(19)
(11) EP 1 155 798 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION

(48) Corrigendum issued on:
24.04.2002 Bulletin 2002/17

(43) Date of publication:
21.11.2001 Bulletin 2001/47

(21) Application number: 01119503.9

(22) Date of filing: 21.03.1997
(51) International Patent Classification (IPC)7: B29C 35/08, H05B 6/80, B29C 65/14
// B29K503:00, B29K307:04, B29K105:10
(84) Designated Contracting States:
AT BE CH DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 29.03.1996 US 626207

(62) Application number of the earlier application in accordance with Art. 76 EPC:
97917578.3 / 0889775

(71) Applicants:
  • Lockheed Martin Energy Research Corporation
    Oak Ridge, TN 37831-8242 (US)
  • Lambda Technologies, Inc.
    Morrisville, NC 27560-9224 (US)

(72) Inventors:
  • Lauf, Robert J.
    Oak Ridge, TN 37830 (US)
  • McMillan, April D.
    Knoxville, TN 37914 (US)
  • Paulauskas, Felix L.
    Oak Ridge, TN 37830 (US)
  • Fathi, Zakaryae
    Cary, NC 27511 (US)
  • Wei, Jianghua
    Raleigh, NC 27612 (US)

(74) Representative: Gerbino, Angelo et al
Jacobacci & Partners S.p.A. Corso Regio Parco, 27
10152 Torino
10152 Torino (IT)

 
Remarks:
This application was filed on 14 - 08 - 2001 as a divisional application to the application mentioned under INID code 62.
 


(54) Adhesive bonding using variable frequency microwave energy


(57) Methods of facilitating the adhesive bonding of various components with variable frequency microwave energy are disclosed. The time required to cure a polymeric adhesive is decreased by placing components to be bonded via the adhesive in a microwave heating apparatus having a multimode cavity and irradiated with microwaves of varying frequences.