(19)
(11) EP 1 163 488 A1

(12)

(43) Date of publication:
19.12.2001 Bulletin 2001/51

(21) Application number: 00921435.4

(22) Date of filing: 22.03.2000
(51) International Patent Classification (IPC)7G01B 11/06, H01L 21/66, G01N 21/88, H01L 21/304, C23C 16/52
(86) International application number:
PCT/US0007/709
(87) International publication number:
WO 0057/127 (28.09.2000 Gazette 2000/39)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 22.03.1999 US 125462 P
12.04.1999 US 128915 P
09.07.1999 US 143199 P
10.12.1999 US 172851 P
01.02.2000 US 495821

(71) Applicant: Sensys Instruments Corporation
Santa Clara, CA 95054 (US)

(72) Inventors:
  • STANKE, Fred, E.
    Cupertino, CA 95014 (US)
  • WEBER-GRABAU, Michael
    Sunnyvale, CA 94087 (US)
  • RUTH, Douglas, E.
    Sunnyvale, CA 94086 (US)
  • TONG, Edric, H.
    Sunnyvale, CA 94086 (US)
  • CAHILL, James, M., Jr.
    San Jose, CA 95120 (US)
  • CARLISLE, Clinton
    Palo Alto, CA 94306 (US)
  • BURKE, Elliot
    Goleta, CA 93117 (US)
  • PHAM, Hung
    San Jose, CA 95132 (US)

(74) Representative: Haines, Miles John 
D. Young & Co. 21 New Fetter Lane
London EC4A 1DA
London EC4A 1DA (GB)

   


(54) METHOD AND APPARATUS FOR WAFER METROLOGY