(19)
(11) EP 1 171 905 A1

(12)

(43) Date of publication:
16.01.2002 Bulletin 2002/03

(21) Application number: 00928143.7

(22) Date of filing: 06.04.2000
(51) International Patent Classification (IPC)7: H01L 21/00
(86) International application number:
PCT/US0009/362
(87) International publication number:
WO 0063/952 (26.10.2000 Gazette 2000/43)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 15.04.1999 US 292491
15.04.1999 US 292495
15.04.1999 US 292496

(71) Applicant: Integrated Materials, Inc.
San Jose, CA 95112 (US)

(72) Inventors:
  • ZEHAVI, Raanan
    Sunnyvale, CA 94087 (US)
  • DAVIS, Robert
    Belmont, CA 94002 (US)

(74) Representative: Cross, Rupert Edward Blount et al
BOULT WADE TENNANT, Verulam Gardens 70 Gray's Inn Road
London WC1X 8BT
London WC1X 8BT (GB)

   


(54) SILICON FIXTURES FOR WAFER PROCESSING AND METHOD OF FABRICATION