(19)
(11) EP 1 181 716 A1

(12)

(43) Date of publication:
27.02.2002 Bulletin 2002/09

(21) Application number: 00928252.6

(22) Date of filing: 20.04.2000
(51) International Patent Classification (IPC)7H01L 21/30
(86) International application number:
PCT/US0010/685
(87) International publication number:
WO 0065/641 (02.11.2000 Gazette 2000/44)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 22.04.1999 US 130842 P

(71) Applicant: California Institute of Technology
Pasadena, CA 91125 (US)

(72) Inventors:
  • Barmatz, Martin B.,California Inst. of Techn.
    Pasadena, CA 91109 (US)
  • Mai, John D.,California Inst. of Techn.
    Mail-Code 302-306,Pasadena, CA 91109 (US)
  • Pike, William T.,California Inst. of Techn.
    Mail-Code 302-231,Pasadena, CA 91109 (US)
  • Budra, Nasser K.,California Inst. of Techn.
    Mail-Code 79-24,Pasadena, CA 91109 (US)
  • Jackson, Henry W.,California Inst. of Techn.
    Mail Code 79-24,Pasadena, CA 91109 (US)

(74) Representative: Lloyd, Patrick Alexander Desmond 
Reddie & Grose 16 Theobalds Road
London WC1X 8PL
London WC1X 8PL (GB)

   


(54) MICROWAVE BONDING OF MEMS COMPONENT