(19)
(11) EP 1 186 216 A1

(12)

(43) Date of publication:
13.03.2002 Bulletin 2002/11

(21) Application number: 00928580.0

(22) Date of filing: 28.04.2000
(51) International Patent Classification (IPC)7H05K 7/20, H05K 5/06, H01L 23/34
(86) International application number:
PCT/US0011/579
(87) International publication number:
WO 0067/541 (09.11.2000 Gazette 2000/45)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 30.04.1999 US 302590
30.04.1999 US 303196

(71) Applicant: Pacific Aerospace and Electronics, Inc.
Wenatchee, WA 98801 (US)

(72) Inventors:
  • JONES, Herman
    Wenatchee, WA 98801 (US)
  • Taylor, Edward
    East Wenatchee, WA 98802 (US)

(74) Representative: Patentanwälte Feldmann & Partner AG 
Kanalstrasse 17
8152 Glattbrugg
8152 Glattbrugg (CH)

   


(54) COMPOSITE ELECTRONICS PACKAGES AND METHODS OF MANUFACTURE