CHIP PACKAGE WITH MOLDED UNDERFILL - Patent 1190448

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EP 1 190 448 A1

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(43)	Date of publication:
	27.03.2002 Bulletin 2002/13

(21)	Application number: 99923109.5

(22)	Date of filing: 14.05.1999

(51)	International Patent Classification (IPC)⁷: H01L 23/28, H01L 23/48, H01L 23/52, H01L 29/40, H01L 23/29

(86)	International application number:
	PCT/US9910/771

(87)	International publication number:
	WO 0070/678 (23.11.2000 Gazette 2000/47)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(71)	Applicant: Hestia Technologies, Inc.
	Santa Clara, CA 95054-2049 (US)

(72)	Inventor:
	WEBER, Patrick, O. San Jose, CA 95136 (US)

(74)	Representative: Weber, Etienne Nicolas et al
	c/o Brevalex,3, rue du Docteur Lancereaux 75008 Paris 75008 Paris (FR)

(54)	CHIP PACKAGE WITH MOLDED UNDERFILL