CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES - Patent 1200843

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EP 1 200 843 A1

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(43)	Date of publication:
	02.05.2002 Bulletin 2002/18

(21)	Application number: 00952386.1

(22)	Date of filing: 28.07.2000

(51)	International Patent Classification (IPC)⁷: G01R 1/073, G01R 3/00

(86)	International application number:
	PCT/US0021/012

(87)	International publication number:
	WO 0109/623 (08.02.2001 Gazette 2001/06)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

28.07.1999 US 146241 P

(71)	Applicant: Nanonexus, Inc.
	Fremont, CA 94539 (US)

(72)	Inventors:
	MOK, Sammy Cupertino, CA 95014 (US) CHONG, Fu, Chiung Saratoga, CA 95070 (US)

(74)	Representative: Leeming, John Gerard
	J.A. Kemp & Co.,14 South Square,Gray's Inn London WC1R 5JJ London WC1R 5JJ (GB)

(54)	CONSTRUCTION STRUCTURES AND MANUFACTURING PROCESSES FOR INTEGRATED CIRCUIT WAFER PROBE CARD ASSEMBLIES