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EP 1 201 789 B9 |
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CORRECTED EUROPEAN PATENT SPECIFICATION |
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Note: Bibliography reflects the latest situation |
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Correction information: |
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Corrected version no 1 (W1 B1) |
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Corrections, see Description |
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Corrigendum issued on: |
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15.11.2006 Bulletin 2006/46 |
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Mention of the grant of the patent: |
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07.06.2006 Bulletin 2006/23 |
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Date of filing: 19.10.2001 |
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International Patent Classification (IPC):
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Plating bath and method for electroplating tin-zinc alloys
Plattierungsbad und Verfahren zur Plattierung von Zinn-Zink Legierungen
Bain de placage et methode d'électroplacage d'alliages étain-zinc
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Designated Contracting States: |
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AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
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Priority: |
19.10.2000 US 691985
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Date of publication of application: |
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02.05.2002 Bulletin 2002/18 |
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Proprietor: ATOTECH Deutschland GmbH |
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10553 Berlin (DE) |
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Inventors: |
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- Opaskar, Vincent C.
Chagrin Falls,
Ohio 44023 (US)
- Capper, Lee Desmond
Wolverhampton,
West Midlands WV11 2 HF (GB)
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Representative: Albrecht, Thomas et al |
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Kraus & Weisert,
Thomas-Wimmer-Ring 15 80539 München 80539 München (DE) |
| (56) |
References cited: :
EP-A- 0 663 460 US-A- 4 163 700 US-A- 5 435 898
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WO-A-00/17420 US-A- 5 405 523
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| Note: Within nine months from the publication of the mention of the grant of the European
patent, any person may give notice to the European Patent Office of opposition to
the European patent
granted. Notice of opposition shall be filed in a written reasoned statement. It shall
not be deemed to
have been filed until the opposition fee has been paid. (Art. 99(1) European Patent
Convention).
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Field of the Invention
[0001] This invention relates to the electrodeposition of tin-zinc alloys. The invention
also relates to a plating bath for depositing tin-zinc alloy coatings on various substrates.
Background of the Invention
[0002] The electrodeposition of tin and various tin alloys has been widely employed to protect
steel and similar metal materials from corrosion, or to improve the solderability
of the metals.
[0003] Tin-zinc alloy plating baths have been described in the prior art. The use of citric
acid or salts of citric acid, and ammonium salts in the electroplating baths is known.
In U.S. Patent 4,163,700, it has been suggested even when tin-zinc electroplating
baths containing citric acid are used, there is still a disadvantage in that when
a metallic ion concentration in the bath gradually increases as the charged current
is increased, an insoluble substance (considered to be a stannate or other metallic
salt) is formed on the anode of tin or tin alloy and then released from the cathode
to be plated which gives an undesirable effect on the plated surface. Accordingly,
in the '700 patent, the patentee suggests the tin or tin alloy electroplating baths
which contain citric acid or its salt and an ammonium salt can be improved by adding
to the bath, at least one saturated hydroxy carboxylic acid or its salt, other than
citric acid, and/or at least one saturated dibasic carboxylic acid or its salt.
[0004] U.S. Patent 4,168,223 also describes an electroplating bath for depositing tin or
a tin alloy such as a tin-zinc alloy with satisfactory brightness. The electroplating
bath comprises a bath having a pH value ranging from 4 to 8 and containing citric
acid or its salts, an ammonium salt, and a water-soluble polymer as a brightener.
The bath may further comprise an aldehyde compound as a co-brightener. The water-soluble
polymers useful as brighteners in these plating baths include polyoxyethylenes, derivatives
thereof, or the reaction products of an epoxy compound with ethylene glycol, propylene
glycol or glycerine.
[0005] U.S. Patent 5,618,402 describes a tin-zinc alloy electroplating bath which comprises
a water-soluble stannous salt, a water-soluble zinc salt, and amphoteric surfactant,
and water. The amphoteric surfactant useable in the plating baths include those of
imidazoline, betaine, alanine, glycine and amide types. The baths also may contain
hydroxy carboxylic acids such as citric acid or gluconic acid.
[0006] Zinc alloy plating baths containing a quaternary ammonium polymer are described in
U.S. Patent 5,405,523. The electroplating baths described in the '523 patent comprise
zinc ions, alloy metal ions of a metal of the first transition series of the Periodic
Table and a quaternary ammonium polymer as a brightener. The electroplating baths
can be either alkaline baths having a pH in the range of from about 9 to 13 or acid
baths having a pH in the range of from 3 to 7. The quaternary ammonium polymers useful
in the plating baths include a ureylene quaternary ammonium polymer, an iminoureylene
quaternary ammonium polymer or a thioureylene quaternary ammonium polymer.
Summary of the Invention
[0007] The present invention relates to an aqueous plating bath for electrodeposition of
tin-zinc alloys comprising at least one bath-soluble stannous salt, at least one bath
soluble zinc salt, and a quaternary ammonium polymer selected from a ureylene quaternary
ammonium polymer, an iminoureylene quaternary ammonium polymer or a thioureylene quaternary
ammonium polymer. The plating baths also may contain one or more of the following
additives: hydroxy polycarboxylic acids or salts thereof such as citric acid; ammonium
salts; conducting salts; aromatic carbonyl-containing compounds; polymers of aliphatic
amines such as a poly(alkyleneimine); and hydroxyalkyl substituted diamines as metal
complexing agents. The plating baths of this invention deposit a bright and level
deposit, and they can be adapted to provide plated alloys having high tin concentration
over a wide current density range.
Detailed Description of the Invention
[0008] The aqueous plating baths of the present invention comprise an aqueous composition
comprising stannous ions in the form of at least one bath-soluble stannous salt, zinc
ions in the form of at least one bath soluble zinc salt, and a quaternary ammonium
polymer selected from a ureylene quaternary ammonium polymer, an iminoureylene quaternary
ammonium polymer or a thioureylene quaternary ammonium polymer. In one embodiment,
the baths also contain at least one hydroxy polycarboxylic acid such as citric acid.
If the acidity of the bath falls below the desired operating range of from about 4
to about 8, or from 5 to about 7, the pH can be increased by the addition of ammonium
hydroxide or an alkali metal hydroxide such as sodium hydroxide or potassium hydroxide.
[0009] The plating bath of the present invention generally will contain stannous ion at
concentrations of from about 1 g/l to about 100 g/l, and zinc ions at a concentration
of from about 0.2 to about 80 g/l. In another embodiment, the plating baths will contain
from about 5 g/l to about 40 g/l of stannous ions and from about 5 to about 50 g/l
of zinc ions. In yet another embodiment, the plating bath may contain from about 10
to about 20 g/l of stannous ion and from about 10 to about 40 g/l of zinc ions. Throughout
this written description of the invention, the range and ratio limits may be combined.
[0010] The stannous ion may be in the form of a soluble salt such as stannous sulfate, stannous
chloride, stannous fluoride, stannous sulfamate, stannous acetate, stannous oxide,
stannous methane sulfonate etc. The zinc ion may be present in the bath in the form
of a soluble salt such as zinc sulfate, zinc chloride, stannous fluoride, zinc fluoroborate,
zinc sulfamate, zinc acetate, etc. Mixtures of the stannous salts and/or zinc salts
may be utilized to provide the desired concentration of tin and zinc. In one embodiment,
the stannous ions and the zinc ions are both present as the chloride salts.
[0011] The relative and total amounts of stannous ions and zinc ions in the electroplating
baths of the invention will influence the tin-zinc alloy distribution, and the appearance
of the deposit. When a plating bath is too low in total metal (e.g., less than 5 g/l)
gas streaking in the high current density range (greater than 40 ASF to 20 ASF) and
the mid current density range (20 ASF to 8 ASF) will result. The ratio of metals also
effects the alloy content. For example, other things being equal, a bath containing
a greater amount of tin will deposit an alloy containing higher tin than a plating
bath containing a lower concentration of tin.
[0012] The plating baths of the present invention can be utilized to deposit tin-zinc alloys
comprise about 50%w up to about 95%w or more of tin and about 5%w up to about 50%w
of zinc. Alloys containing about 70-80% of tin and 20 to 30% of zinc are useful in
corrosion prevention (for example, of fasteners) and alloys containing about 90% tin
and about 10% zinc are useful in electronic applications where soldering is required.
[0013] The electroplating baths of the present invention also contain at least one quaternary
ammonium polymer which may be a ureylene quaternary ammonium polymer, an iminoureylene
quaternary ammonium polymer or a thioureylene quaternary ammonium polymer. The amount
of the quaternary ammonium polymer included in the tin-zinc alloy plating baths is
an amount sufficient to provide desired improvements in the deposited tin-zinc alloy
such as reduced burning of the high current density deposits, and improved grain refinement.
When used with brightener compositions such as aromatic aldehydes and ketones (described
more fully below), improved brightness is obtained. Generally, the tin-zinc alloy
plating baths will contain from about 0.2 to about 2.5 g/l of the quaternary ammonium
polymer. In another embodiment the bath will contain from about 0.5 to about 2.0 g/l
of the quaternary ammonium polymer.
[0014] Quaternary ammonium polymers which are useful in the present invention may be prepared
by condensation copolymerization of one or more ditertiary amine monomers with one
or more aliphatic dihalides. In one embodiment, the ditertiary amines useful in the
copolymerization reaction may be represented by Formula II
(R)(R)N-(CH
2)
a-NHC(Y)NH-(CH
2)
b-N(R)(R) II
wherein each R is independently a methyl, ethyl, isopropyl, hydroxymethyl, hydroxyethyl,
or -CH
2CH(OCH
2CH
2)
cOH group; a, b and c are each independently 1 to about 6; and Y is O, S, or NH. In
one embodiment, each R is a methyl group and Y is O. In another embodiment, a and
b are each independently 2 or 3.
[0015] The ditertiary amine represented by Formula II can be prepared by reacting one mole
of urea, thiourea or guanidine with two moles of a diamine containing one tertiary
amine group and either one primary or one secondary amine group (preferably an amine
having one tertiary and one primary amine group) as represented by Formula I.
R(R)N-(CH
2)
a-N(R
7)H I
wherein R is as defined in Formula II, R
7=R or H, and a is 1 to about 6. In one embodiment, R
7 is hydrogen. Specific examples of such diamines include dimethyl aminoethyl amine,
3(dimethylaminopropyl) amine, and 3(diethylamino) propylamine.
[0016] In one embodiment, each R in Formula II (and R
7 Formula I) is independently a methyl group, a, b and c are each independently 2 or
3 and Y is O. In another embodiment, each R in Formula II is a methyl group, Y is
O and a and b are 3.
[0017] Generally the ditertiary amine (II) is formed by heating together the diamine of
Formula I and urea, thiourea or guanidine at an elevated temperature, removing ammonia
with a vacuum or by bubbling gas such as air or nitrogen through the reaction mass.
Temperatures as high as 80°C may be used.
[0018] The aliphatic dihalide which is reacted with the ditertiary amine of Formula II can
be represented by Formula III.
X-R
1-X III
wherein X is a halide, and R
1 is (CH
2)
d or ⁅(CH
2)
eO(CH
2)
f⁆
g where d, e and f are each independently from 1 to about 6, and g is from 1 to about
4. Specific examples of such dihalides include compounds of the formulae: Cl-CH
2OCH
2-Cl; Cl-CH
2CH
2OCH
2CH
2-Cl; Cl-CH
2CH
2-OCH
2CH
2OCH
2CH
2-Cl; Cl-CH
2CH
2-Cl,Br-CH
2CH
2-Br; Cl-CH
2CH
2CH
2-Cl; Cl-CH
2CH
2CH
2CH
2-Cl; etc.
[0019] The quaternary ammonium polymer is obtained when the ditertiary amine represented
by Formula II is reacted with the dihalide of Formula III. The ditertiary amine (II)
may be dissolved in water, in alcohol, or in another suitable solvent and condensed
with dihalide (III) to form the desired polymer. Alternatively, the reaction can be
carried out in the absence of a diluent. Toward the end of the reaction, chain terminating
agents may be added if appropriate. The reaction of the ditertiary amine and the dihalide
is carried out at elevated temperatures such as, for example, from about 35°C to about
120°C. The progress of the reaction can be followed by analyzing for free halide ion
or for tertiary amine. A chain terminating agent may be added to control the molecular
weight of the polymer or to alter the characteristics of the polymer. Although not
wishing to be bound by any theory or formula, it is believed that the quaternary ammonium
polymer formed in this manner may be characterized by the following formula IV.
⁅N
⊕(R)(R)-(CH
2)
a-N(H)-C(Y)-N(H)-(CH
2)
b-N
⊕(R)(R)-R
1⁆
n 2nX
- IV
where each R is independently a methyl, ethyl, isopropyl, hydroxymethyl, hydroxyethyl,
or -CH
2CH
2(OCH
2CH
2)
c OH group; Y is O, S, or NH; a, b and c are each independently 1-6; and R
1 is (CH
2)
d or ⁅(CH
2)
eO(CH
2)
f⁆g where d, e and f are each independently from 1 to about 6, and g is from 1 to about
4; n is at least 1 and X
- is a halide ion.
[0020] The molecular weight of the quaternary ammonium polymers may range from about 300
to about 100,000. In one embodiment, the molecular weight of the polymer is from about
350 to 3000.
[0021] The quaternary ammonium polymers which are useful in the present invention and the
procedure for preparing the polymers which have been described above, are disclosed
in more detail in U.S. Patent No. 4,157,388. The disclosure of U.S. Patent No. 4,157,388
is hereby incorporated by reference.
[0022] A ureylene quaternary ammonium polymer which has been found to be useful in the plating
baths of the present invention is one that is available commercially from the Miranol
Chemical Company under the trademark Mirapol A-15. It is believed that this product
is one that is prepared by the sequence of reactions which include: dimethylamino
propyl amine (2 moles) with 1 mole of urea to form the ditertiary amine monomer as
represented above in Formula II, and the ditertiary amine monomer is then subjected
to a second condensation reaction with bis(2-haloethyl) ether to form the desired
quaternary ammonium polymer which is believed to have an average molecular weight
of about 2200.
[0023] The plating baths of the invention generally may contain one or more conducting salts
such as sodium chloride, sodium fluoride, sodium sulfate, potassium chloride, potassium
fluoride, potassium sulfate and, ammonium chloride, ammonium fluoride, and ammonium
sulfate. The conductive salts may be present in the plating baths in amounts ranging
from about 50 to about 300 g/l or more. In one embodiment, the conductive salt is
a chloride, the stannous salt is a chloride, and the zinc salt is a chloride, thus
forming an "all chloride" plating bath. In one embodiment, the presence of the chloride
in the bath appears to promote the corrosion of the anode which is desirable to prevent
or reduce polarization of the anode and oxidation of stannous to stannic ion on the
surface of the anode. The chloride enables the anode to dissolve more uniformly from
the stannous oxide film normally formed on the surface of the anode. In one embodiment,
the amount of chloride ion in the bath is about 1.0 to about 1.7 moles of chloride
ion per mole of total metal ions (Sn
++ and Zn
++). If the mole ratio is 2 or more, it is believed that the metal/citrate complex may
incorporate excess chloride into its structure, and the chloride ion containing complex
becomes susceptible to hydrolysis.
[0024] The plating baths of the present invention also may contain at least one hydroxy
polycarboxylic acid containing from 3 to about 15 carbon atoms, or a water soluble
salt thereof. In one embodiment the hydroxy polycarboxylic acids contain 3 to 7 carbon
atoms. Mixtures of the hydroxy polycarboxylic acids can be utilized. Examples of hydroxy
polycarboxylic acids which can be utilized in the plating baths of the present invention
include monohydroxy and polyhydroxy polycarboxylic acids such as tartaric acid, malic
acid, citric acid, gluconic acid, and their sodium, potassium or ammonium salts. Citric
acid is a particularly useful hydroxy polycarboxylic acid in the electroplating baths
of the present invention. The amount of the hydroxy polycarboxylic acid (e.g., citric
acid) incorporated into the plating baths of the invention generally is at least 2
moles per mole of combined stannous and zinc ions. Both metal ions form complexes
with citric acid. Accordingly, from about 50 to about 200 g/l of citric acid is included
in the tin-zinc plating baths. In another embodiment, the baths contain from 75 to
150 g/l of citric acid.
[0025] In some instances, the aqueous tin-zinc alloy plating baths of the present invention
also may contain one or more brightener compounds known in the art. In one embodiment
the plating baths contain at least one brightener selected from aromatic carbonyl-containing
compounds. The carbonyl compounds are useful in improving the brightness and luster
of the deposits produced by the aqueous tin-zinc plating baths of the present invention.
The aromatic carbonyl-containing compounds act as a brightener imparting optimum leveling
action over a wider plating range. The aromatic carbonyl-containing compounds may
be aromatic aldehydes, ketones, or carboxylic acids or the soluble salts thereof.
In one embodiment, the carbonyl-containing compounds include aromatic aldehydes, acetophenones,
and carbonyl compounds having the general formula
Ar C(H)=C(H)-C(O)-CH
3
wherein Ar is a phenyl, napthyl, pyridyl, thiophenyl or furyl group. Examples of aromatic
aldehydes containing a phenyl group include: benzaldehyde; o-chlorobenzaldehyde; o-hydroxybenzaldehyde;
o-aminobenzaldehyde; veratraldehyde; 2,4-dichlorobenzaldehyde; 3,4-dichlorobenzaldehyde,
3,5-dichlorobenzaldehyde; 2,6-dichlorobenzaldehyde; tolualdehyde; 3,4-dimethoxybenzaldehyde;
cinnamaldehyde; and anisaldehyde. Examples of the naphaldehydes include 1-naphthaldehyde;
2-naphthaldehyde; 2-methoxy-1-naphthaldehyde; 2-hydroxy-1-naphthaldehyde; 2-ethoxy-1-naphthaldehyde;
4-methoxy-1-naphthaldehyde; 4-ethoxy-1-naphthaldehyde; and 4-hydroxy-1-naphthaldehyde.
In some applications, a combination of the naphthaldehyde with a benzaldehyde such
as 1-naphthaldehyde with 2,6-dichlorobenzaldehyde provides a superior deposit on the
substrates. Examples of other carbonyl compounds include aromatic aldehydes and aromatic
ketones such as benzylidene acetone, coumarin, acetophenone, propiophenone, 3-methoxybenzol
acetone. Other carbonyl compounds include furfurylidine acetone, 3-indole carboxyaldehyde
and thiophene carboxyaldehyde. The amount of aromatic aldehyde or other carbonyl containing
compound included in the baths of the invention will range up to about 2 grams per
liter of bath and preferably is from about 0.005 to about 2 grams per liter of bath.
The aldehyde brighteners generally are added to the electroplating baths as a bisulfite
addition product.
[0026] Mixtures of aliphatic aldehydes and the above-described aromatic aldehydes, and mixtures
of naphthaldehydes and benzaldehydes also are useful. Examples of suitable combinations
include: the mixture of acetaldehyde and 4-methoxy-1-naphthaldehyde; the mixture of
formaldehyde, 1-naphthaldehyde, and 2,6-dichlorobenzaldehyde; etc.
[0027] Other useful aromatic carboxyl containing brightener compounds include the aromatic
carboxylic acids and salts such as benzoic acid, sodium benzoate, sodium salicylate,
and 3-pyridine carboxylic acid (nicotinic acid).
[0028] The tin-zinc plating baths of the present invention also may contain at least one
polymer of an aliphatic amine as a supplemental brightener and as a grain refiner.
The amount of the polymer of an aliphatic amine contained in the aqueous tin-zinc
plating baths of the present invention may range from about 0.5 to about 10 g/l although
larger amounts can be utilized in some instances. In one embodiment, the plating baths
contain from about 0.5 to about 5 g/l of the polymer of an aliphatic amine.
[0029] Typical aliphatic amines which may be used to form polymers include 1,2-alkyleneimine,
monoethanolamine, diethanolamine, triethanolamine, ethylenediamine, diethylenetriamine,
amino-bis-propylamine, triethylene tetramine, tetraethylene pentemene, hexamethylenediamine,
etc.
[0030] In one embodiment, the polymers of aliphatic amines utilized in the plating baths
of the invention are polymers derived from 1,2-alkyleneimines which may be represented
by the general formula

wherein A and B are each independently hydrogen or alkyl groups containing from 1
to about 3 carbon atoms. Where A and B are hydrogen, the compound is ethyleneimine.
Compounds wherein either or both A and B are alkyl groups are referred to herein generically
as alkyleneimines although such compounds have been referred to also as alkyleneimine
derivatives.
[0031] Examples of poly(alkyleneimines) which are useful in the present invention include
polymers obtained from ethyleneimine, 1,2-propyleneimine, 1,2-butyleneimine and 1,1-dimethylethyleneimine.
The poly(alkyleneimines) useful in the present invention may have molecular weights
of from about 100 to about 100,000 or more although the higher molecular weight polymers
are not generally as useful since they have a tendency to be insoluble in the plating
baths of the invention. In one embodiment, the molecular weight will be within the
range of from about 100 to about 60,000 and more often from about 150 to about 2000.
Useful polyethyleneimines are available commercially from, for example, BASF under
the designations Polymin G-15 (molecular weight 150), Polymin G-20 (molecular weight
200) and Polymin G-35 (molecular weight 1400).
[0032] The aqueous tin-zinc plating bath of the present invention also may contain at least
one metal complexing agent characterized by the formula
R
3(R
4)N-R
2-N(R
5)R
6 VI
wherein R
3, R
4, R
5, and R
6 are each independently alkyl or hydroxyalkyl groups provided that at least one of
R
3-R
6 is a hydroxyalkyl group, and R
2 is a hydrocarbylene group containing up to about 10 carbon atoms. The presence of
the complexing agent in the plating baths of the invention also results in an improvement
of the alloy range over an extended current density, and overall appearance of the
deposit, particularly at low current densities (e.g., less than 10 ASF). The amount
of such metal complexing agent included in the plating baths of the present invention
may vary over a wide range, and generally, the amount of the metal complexing agent
will range from about 5 to about 100 g/l, and more often, the amount will be in the
range of from about 10 to about 30 g/l. The groups R
3-R
6 may be alkyl groups containing from 1 to 10 carbon atoms, more often alkyl groups
containing from 1 to 5 carbon atoms, or these groups may be hydroxyalkyl groups containing
from 1 to 10 carbon atoms, more often from 1 to about 5 carbon atoms. The hydroxyalkyl
groups may contain one or more hydroxyl groups, and more often at least one of the
hydroxyl groups present in the hydroxyalkyl groups is a terminal group. In one preferred
embodiment, R
3, R
4, R
5 and R
6 are hydroxyalkyl groups.
[0033] Specific examples of metal complexing agents characterized by Formula VI include
N-(2-hydroxyethyl)-N,N',N'-triethylethylenediamine; N,N'-di(2-hydroxyethyl)N,N'-diethyl
ethylenediamine; N,N-di(2-hydroxyethyl)-N',N'-diethyl ethylenediamine; N,N,N',N'-tetrakis(2-hydroxyethyl)ethylenediamine;
N,N,N',N'-tetrakis(2-hydroxyethyl)propylenediamine; N,N,N',N'-tetrakis(2,3-dihydroxypropyl)ethylenediamine;
N,N,N',N'-tetrakis(2,3-dihydroxypropyl)propylenediamine; N,N,N',N'-tetrakis(2-hydroxypropyl)ethylenediamine;
N,N,N',N'-tetrakis(2-hydroxyethyl)1,4-diaminobutane; etc. An example of a commercially
available metal complexing agent useful in this invention includes Quadrol Polyol
from BASF. Quadrol Polyol is the reaction product of 1 mole of ethylenediamine with
4 moles of propylene oxide.
[0034] The properties of the tin-zinc alloy deposited by the plating baths of the present
invention may be enhanced further by including other additives in the baths such as
a small amount of the nitrogen-containing compound which is obtained by reacting (a)
ammonia, an aliphatic amine containing at least one primary amine group, or mixtures
of two or more of any of these, with (b) one or more epihalohydrin, glycerol halohydrin
or mixtures thereof. When incorporated in the bath, the bath generally will contain
from about 0.10 to about 5 g/l of such nitrogen-containing compound. The preparation
of such nitrogen containing compounds is described in, for example, U.S. Patent Nos.
2,791,554.
[0035] Examples of aliphatic amines which are useful for preparing these compounds include
the aliphatic acyclic amines such as methylamine, ethylamine, propylamine, butylamine,
etc., and alkylene polyamines having the general formula VII:
H
2N-(alkylene NH)
x-alkylene NH
2 VII
wherein x is an integer from zero to four and the alkylene may be a straight or branched
chain group containing up to about six carbon atoms. Examples of such alkylene polyamines
containing at least one primary amine group include ethylene diamine, triethylamine
tetramine, propylene diamine, N-ethyl-ethylene diamine, tripropylene tetramine, tetraethylene
pentamine and pentaethylene hexamine. Combinations of ammonia with one or more of
the aliphatic amines can be reacted with the epoxy compound as well as combinations
of the aliphatic acyclic amines.
[0036] The epihalohydrins that may be reacted with the ammonia and/or aliphatic amines include
epihalohydrins and derivatives of epihalohydrins having the formula

wherein X is halogen and R is hydrogen or a lower alkyl group. Examples of such compounds
include epichlorohydrin, epibromohydrin and 1-chloro-2,3-epoxybutane. Epichlorohydrin
is preferred. Other compounds having similar reactivity to the epihalohydrins, such
as glycerol halohydrins, having the following formula may be utilized:
CH
2X-CHX-CH
2X IX
wherein at least one but not more than two of the Xs are hydroxy groups and the remaining
Xs are chlorine or bromine. Examples of such reactants include, for example, 1,3-dichloro-2-hydroxypropane,
3-chloro-1,2-dihydroxypropane, and 2,3-dichloro-1-hydroxypropane.
[0037] The nitrogen-containing compound utilized in the baths of the invention may be prepared
in accordance with the general methods described in U.S. Pat. No. 2,791,554. The reaction
products of epichlorohydrin and ammonia or ethylene diamine are described in U.S.
Patent 2,860,089, and in U.S. Patent 3,227,638, the reaction product of epichlorohydrin
and hexamine is described. The disclosures of those patents are hereby incorporated
by reference. Various ratios of the ingredients may be selected although generally
the ammonia or aliphatic amines containing one primary amine group are reacted with
epihalohydrin or glycerol halohydrin in a molar ratio of at least 2:1. The reaction
between aliphatic amines containing two primary amine groups such as ethylene diamine
with epihalohydrin or glycerol halohydrin normally is conducted with molar ratios
of at least about 1:1. More specifically, the nitrogen-containing compounds utilized
in the invention are prepared by mixing the ammonia or amine compound with water in
a reaction vessel followed by the addition of the epihalohydrin or glycerol halohydrin
while maintaining the reaction temperature below about 60°C. One nitrogen containing
compound that is useful in the tin-zinc plating baths of the invention and which exerts
a positive grain refining effect on a tin-zinc bath is the reaction product of one
mole of ethylenediamine with one mole of epichlorohydrin. This additive also appears
to reduce high current density burning.
[0038] The tin-zinc electroplating baths of the present invention can be prepared by techniques
well known to those skilled in the art, and generally, the ingredients in the particular
electroplating bath can be mixed in water with stirring in any order. In one embodiment,
the stannous salt, zinc salt, conducting salts and citric acid are added to water
in any order followed by the addition of ammonium hydroxide to adjust the pH of the
bath. The remaining organic components are added in amounts sufficient to provide
the desired concentrations.
[0039] In practice of the present invention, the bath is operated at conventional temperatures
and an average cathode current density in the range of from 80 ASF to 2 ASF. Typically
the cathode current density is about 20 ASF to 15 ASF.
[0040] The following examples illustrate the tin-zinc electroplating baths of the present
invention and their utility. Unless otherwise indicated in the examples and elsewhere
in the specification and claims, all parts and percentages are by weight, temperatures
are in degrees centigrade, and pressure is at or near atmospheric pressure.
[0041] The utility of the plating baths is demonstrated by plating steel Hull Cell panels
in a 267 ml Hull Cell. The testing is conducted at room temperature at 1 amp for 5
to 10 minutes. Current densities are measured with a Hull Cell scale.
Example 1
[0042]
| |
g/l |
| Stannous ion (SnCl2) |
4.3 |
| Zinc ion (ZnCl2) |
8.6 |
| Potassium chloride |
140.0 |
| Citric acid |
100.0 |
| NH4OH |
* |
| Polymin G-35 |
0.4 |
| Mirapol A-15 |
0.2 |
| Water |
to make 1 liter |
| *sufficient to provide the bath with pH = 6 |
[0043] The Hull Cell panel obtained in this example has a uniform, smooth, white-gray matte
deposit from end to end after 10 minutes. The deposited tin-zinc alloy contains from
70-80% tin from 40 ASF down to 15 ASF.
Example 2
[0044]
| Stannous ion (SnCl2) |
10.0 |
| Zinc ion (SnCl2) |
10.0 |
| Citric acid |
100.0 |
| Sodium sulfate |
100.0 |
| NH4OH |
* |
| Mirapol A-15 |
8.0 |
| Water |
to make 1 liter |
| pH = 6.0 |
|
| *sufficient to provide the bath with pH = 6 |
[0045] The Hull Cell panel obtained in this example has a white matte deposit with some
streaking. The deposited tin-zinc alloy contains 70-80% tin from 10 ASF down to 4
ASF.
Example 3
[0046]
| Stannous ion (SnCl2) |
10.0 |
| Zinc ion (SnCl2) |
10.0 |
| Citric acid |
100.0 |
| Sodium sulfate |
100.0 |
| NH4OH |
* |
| Mirapol A-15 |
8.0 |
| Quadrol Polyol |
15 |
| Water |
to make 1 liter |
| *sufficient to provide the bath with pH = 6 |
[0047] The Hull Cell panel obtained in this example has a uniform, smooth, white-gray tin-zinc
deposit containing 70-80% of tin between 40 ASF and 2 ASF.
Example 4
[0048]
| Stannous ion (SnCl2) |
10.0 |
| Zinc ion (SnCl2) |
10.0 |
| Citric acid |
100.0 |
| Sodium sulfate |
100.0 |
| NH4OH |
* |
| Mirapol A-15 |
8.0 |
| Quadrol Polyol |
15.0 |
| Polymin G-35 |
2.4 |
| Water |
to make 1 liter |
| *sufficient to provide the bath with pH = 6 |
[0049] The Hull Cell panel obtained in this example has a smooth, uniform, light gray tin-zinc
deposit containing 70-80% tin between 40 ASF and 8 ASF.
Example 5
[0050]
| Stannous ion (SnCl2) |
15.0 |
| Zinc ion (ZnCl2) |
30.0 |
| Citric acid |
100.0 |
| Sodium sulfate |
80.0 |
| Ammonium hydroxide |
* |
| Quadrol Polyol |
28 |
| Mirapol A-15 |
0.8 |
| Water |
to make 1 liter |
| *sufficient to provide the bath with pH = 5.3 |
[0051] The Hull Cell panel obtained in this example has a uniform, smooth gray tin-zinc
deposit containing 70-80% tin between 40 ASF and 1 ASF.
Example 6
[0052]
| Stannous ion (SnCl2) |
10 |
| Zinc ion (ZnCl2) |
15 |
| Citric acid |
100 |
| Sodium sulfate |
80 |
| Quadrol Polyol |
3 |
| Mirapol A-15 |
0.8 |
| Anisaldehyde-bisulfite |
0.008 |
| Ethylene diamine-epichlorohydrin reaction product (1:1 mole) |
4.0 |
| NH4OH |
* |
| Water |
to make 1 liter |
| * sufficient to provide the bath with pH = 5.6 |
[0053] The Hull Cell panel obtained in this example has a uniform, smooth gray tin-zinc
deposit which displays a semibright sheen in the areas between 49 ASF and 5 ASF. The
deposit contains 70-80% tin.
Example 7
[0054]
| Stannous ion (SnCl2) |
16 |
| Zinc ion (ZnCl2) |
10 |
| Citric acid |
100 |
| Sodium sulfate |
100 |
| NH4OH |
* |
| Mirapol A-15 |
0.8 |
| Quadrol Polyol |
3.5 |
| Water |
to make 1 liter |
| * sufficient to provide the bath with pH = 6 |
[0055] The Hull Cell panel obtained in this example has a uniform, smooth gray-white tin-zinc
deposit after 10 minutes which contains 80-90% tin. The deposit is solderable.
[0056] While the invention has been explained in relation to its preferred embodiments,
it is to be understood that various modifications thereof will become apparent to
those skilled in the art upon reading the specification. Therefore, it is to be understood
that the invention disclosed herein is intended to cover such modifications as fall
within the scope of the appended claims.
1. An aqueous plating bath for electrodeposition of tin-zinc alloys comprising at least
one bath-soluble stannous salt, at least one bath soluble zinc salt, and a quaternary
ammonium polymer selected from a ureylene quaternary ammonium polymer, an iminoureylene
quaternary ammonium polymer or a thioureylene quaternary ammonium polymer.
2. The plating bath of claim 1 wherein the pH of the bath is in the range of from about
4 to about 8.
3. The plating bath of claim 1 wherein the stannous and zinc salts are salts selected
from the chloride, bromide, fluoride, sulfate, or oxide salts, or mixtures thereof.
4. The plating bath of claim 1 wherein the water-soluble stannous salt is present in
an amount to provide from about 1 to about 100 g/l of stannous ions.
5. The plating bath of claim 1 wherein the water soluble zinc salt is present in an amount
to provide from about 0.1 to about 80 g/l of zinc ions.
6. The plating bath of any preceding claim wherein the quaternary ammonium polymer is
prepared by reacting (a) at least 2 moles of a diamine containing one tertiary amine
group and one primary or secondary amine group with (b) one mole of urea, thiourea
or amidine with the removal of ammonia to form a ditertiary amine which is thereafter
reacted with (c) a dihalide.
7. The plating bath of claim 6 wherein the diamine (a) is characterized by the Formula II
(R)(R)N-(CH2)a-NHC(Y)NH-(CH2)b-N(R)(R) II
wherein each R is independently a methyl, ethyl, isopropyl, hydroxymethyl, hydroxyethyl,
or -CH2CH(OCH2CH2)cOH group; a, b and c are each independently 1 to about 6; and Y is O, S, or NH.
8. The plating bath of claim 7 wherein Y is O, and a and b are 3.
9. The plating bath of claim 6 wherein the dihalide (c) is characterized by the Formula III.
X-R1-X III
wherein X is a halide, and R1 is (CH2)d or ⁅(CH2)eO(CH2)f⁆g where d, e and f are each independently from 1 to about 6, and g is from 1 to about
4.
10. The plating bath of claim 9 wherein R1 is ⁅(CH2)e-O-(CH2)f⁆g, e and f are 2, and g is 1.
11. The plating bath of any one of claims 1-5 wherein the quaternary ammonium polymer
is a ureylene quaternary ammonium polymer.
12. The plating bath of claim 11 wherein the ureylene quaternary ammonium polymer is prepared
by reacting (a) two moles of a diamine containing one tertiary amine group and one
primary or secondary amine group with (b) one mole of urea with the removal of ammonia
to form a ditertiary amine which is then reacted with (c) a dihalide.
13. The plating bath of claim 1 2 wherein the diamine is characterized by the Formula IIa
(R)(R)N-(CH2)a-NHC(O)NH-(CH2)b-N(R)(R) IIa
wherein each R is independently a methyl, ethyl, isopropyl, hydroxymethyl, hydroxyethyl,
or -CH2CH(OCH2CH2)cOH group, and a, b and c are each independently 1 to about 6.
14. The plating bath of claim 13 wherein each R is methyl, and a and b are 3.
15. The plating bath of claim 12 wherein the dihalide is represented by the Formula III
X-R1-X III
where X is a halide, and R1 is (CH2)d or ⁅(CH2)eO(CH2)f⁆ wherein d, e and f are each independently from 1 to about 6, and g is from 1 to
about 4.
16. The plating bath of claim 15 wherein R1 is ⁅(CH2)c-O-(CH2)f-⁆g where e and f are each 2 and g is 1.
17. The plating bath of any preceding claim wherein the bath also contains an alkali metal
hydroxide or ammonium hydroxide in an amount sufficient to provide a plating bath
having a pH of from about 4 to about 8.
18. The plating bath of any of claims 1-5 wherein the quaternary ammonium polymer is characterized by the formula
⁅N⊕(RHR)-(CH2)a-N(H)-C(Y)-N(H)-(CH2)b-N⊕(R)(R)-R1⁆n 2nX- IV
wherein each R is independently a methyl, ethyl, isopropyl, hydroxyethyl or CH2CH2-(OCH2CH2)c OH group; a, b and c, are each independently from 1 to about 6; Y is O, S or NH;
n is at least 1; R1 is (CH2)d or ⁅(CH2)e-O-(CH2)f⁆g wherein d, e and f are each independently from 1 to about 6, and g is from 1 to about
4; and X- is a halide ion.
19. The plating bath of claim 18 wherein Y in Formula IV is O, and the quaternary ammonium
polymer has a molecular weight of from about 350 to about 3000.
20. The plating bath of claim 18 wherein the pH of the bath is in the range of from about
5 to about 7.
21. The plating bath of any preceding claim wherein the bath contains from about 5 to
about 30 g/l of stannous ion and from about 5 to about 50 g/l of zinc ion.
22. The plating bath of any preceding claim wherein the bath also contains at least one
hydroxy polycarboxylic acid containing from 3 to about 15 carbon atoms, or a water
soluble salt thereof.
23. The plating bath of claim 1, comprising:
(A) from about 5 to about 30 g/l of the stannous salt,
(B) from about 5 to about 50 g/l of the zinc salt,
(C) from about 0.5 to about 2.0 g/l of the ureylene quaternary ammonium polymer, wherein
the polymer is prepared by reacting (a) at least two moles at least one diamine represented
by Formula I
R(R)N-(CH2)a-N(R7)H I
where each R is independently a methyl, ethyl, isopropyl, hydroxymethyl, hydroxyethyl,
or -CH2CH(OCH2CH2)c OH group, R7 is hydrogen or R, and a is 1 to about 6, with (b) one mole of urea to form a ditertiary
amine which is then reacted with (c) a dihalide represented by Formula IIIa
X-(CH2)eO(CH2)f-X IIIa
where X is a halide and e and f are each independently 2 or 3, and
(D) at least two moles of at least one hydroxy polycarboxylic acid per mole of combined
stannous and zinc ions in the plating bath.
24. The plating bath of claim 23 wherein in Formula I, each R is methyl, R7 is hydrogen, a is 3, and in Formula llla, X is chlorine and e and f are 2.
25. The plating bath of any preceding claim wherein the hydroxy polycarboxylic acid is
citric acid or a water soluble salt of citric acid.
26. The plating bath of any preceding claim also containing at least one polymer of an
aliphatic amine.
27. The plating bath of claim 26 wherein the polymer is a poly(alkyleneimine).
28. The plating bath of claim 27 wherein the poly(alkyleneimine) is present from about
0.5 to about 5 g/l
29. The plating bath of claim 27 wherein the poly(alkyleneimine) is a poly(ethyleneimine)
having a molecular weight of from about 100 to about 100,000.
30. The plating bath of any preceding claim also containing from about 50 to about 300
g/I of at least one conductive salt.
31. The plating bath of claim 30 wherein the conductive salt is selected from alkali metal
or ammonium halides, sulfates and mixtures thereof.
32. The plating bath of any preceding claim also containing from about 10 to about 30
g/l of at least one metal complexing agent characterized by the formula
R3(R4)N-R2-N(R5)R6 VI
wherein R3, R4, R5 and R6 are each independently alkyl or hydroxyalkyl groups provided that at least one of
R3-R6 is a hydroxyalkyl group, and R2 is a hydrocarbylene group containing up to about 10 carbon atoms.
33. The plating bath of any preceding claim wherein the quaternary ammonium polymer has
a molecular weight of from about 300 to about 3000.
34. The plating bath of any preceding claim also containing an effective amount of at
least one supplemental brightener selected from aromatic carbonyl-containing compounds.
35. A method of electrodepositing a bright tin-zinc alloy on a substrate which comprises
electroplating said substrate in the plating bath of any preceding claim.
1. Wässriges Plattierungsbad für die elektrolytische Abscheidung von Zinn-Zink-Legierungen,
umfassend mindestens ein badlösliches Zinn(II)-Salz, mindestens ein badlösliches Zinksalz
und ein quaternäres Ammoniumpolymer, ausgewählt aus einem quaternären Ureylen-Ammoniumpolymer,
einem quaternären Iminoureylen-Ammoniumpolymer oder einem quaternären Thioureylen-Ammoniumpolymer.
2. Plattierungsbad nach Anspruch 1, worin der pH des Bads im Bereich von etwa 4 bis etwa
8 liegt.
3. Plattierungsbad nach Anspruch 1, worin die Zinn(II)- und Zinksalze ausgewählt sind
aus den Chlorid-, Bromid-, Fluorid-, Sulfat- oder Oxidsalzen oder Gemischen davon.
4. Plattierungsbad nach Anspruch 1, worin das wasserlösliche Zinn(II)-Salz in einer Menge
vorliegt, dass etwa 1 bis etwa 100 g/l Zinnionen erhalten werden.
5. Plattierungsbad nach Anspruch 1, worin das wasserlösliche Zinksalz in einer Menge
vorliegt, dass von 0,1 bis etwa 80 g/l Zinkionen erhalten werden.
6. Plattierungsbad nach einem der vorhergehenden Ansprüche, worin das quaternäre Ammoniumpolymer
hergestellt wird durch Umsetzung von (a) mindestens 2 Mol eines Diamins, das eine
tertiäre Amingruppe und eine primäre oder sekundäre Amingruppe enthält, mit (b) einem
Mol Harnstoff, Thioharnstoff oder Amidin unter Entfernung von Ammoniak zur Herstellung
eines ditertiären Amins, das danach mit (c) einem Dihalogenid umgesetzt wird.
7. Plattierungsbad nach Anspruch 6, worin das Diamin (a) gekennzeichnet ist durch die Formel II
(R)(R)N-(CH2)a-NHC(Y)NH-(CH2)b-N(R) (R) II
worin R jeweils unabhängig eine Methyl-, Ethyl-, Isopropyl-, Hydroxymethyl-, Hydroxyethyl-
oder -CH2CH(OCH2CH2)cOH-Gruppe ist; a, b und c unabhängig voneinander für 1 bis etwa 6 stehen und Y O,
S oder NH ist.
8. Plattierungsbad nach Anspruch 7, worin Y O ist und a und b 3 sind.
9. Plattierungsbad nach Anspruch 6, worin das Dihalogenid (c) gekennzeichnet ist durch die Formel III
X-R1-X III
worin X ein Halogenid ist und R1 (CH2)d oder ⁅(CH2)eO(CH2)f⁆g ist, worin d, e und f jeweils unabhängig voneinander für 1 bis etwa 6 stehen und
g 1 bis etwa 4 ist.
10. Plattierungsbad nach Anspruch 9, worin R1 ⁅(CH2)e-O-(CH2)f⁆g ist, e und f 2 sind und g 1 ist.
11. Plattierungsbad nach einem der Ansprüche 1 bis 5, worin das quaternäre Ammoniumpolymer
ein quaternäres Ureylenammoniumpolymer ist.
12. Plattierungsbad nach Anspruch 11, worin das quaternäre Ureylenammoniumpolymer hergestellt
wird durch Umsetzung von (a) zwei Mol eines Diamins, das eine tertiäre Amingruppe
und eine primäre oder sekundäre Amingruppe enthält, mit (b) einem Mol Harnstoff unter
Entfernung von Ammoniak zur Herstellung eines ditertiären Amins, das anschließend
mit (c) einem Dihalogenid umgesetzt wird.
13. Plattierungsbad nach Anspruch 12, worin das Diamin durch die Formel IIa
R) (R)N-(CH2)a-NHC(O)NH-(CH2)b-N(R) (R) IIa
gekennzeichnet ist, worin R jeweils für eine Methyl-, Ethyl-, Isopropyl-, Hydroxymethyl-, Hydroxyethyl-
oder -CH2CH(OCH2CH2)cOH-Gruppe steht; a, b und c unabhängig voneinander für 1 bis etwa 6 stehen.
14. Plattierungsbad nach Anspruch 13, worin R jeweils Methyl ist und a und b 3 sind.
15. Plattierungsbad nach Anspruch 12, worin das Dihalogenid durch die Formel III
X-R1-X III
repräsentiert wird, worin X ein Halogenid ist und R1 (CH2)d oder ⁅(CH2)eO(CH2)f⁆g ist, worin d, e und f jeweils unabhängig voneinander für 1 bis etwa 6 stehen und
g 1 bis etwa 4 ist.
16. Plattierungsbad nach Anspruch 15, worin R1 ⁅(CH2)e-O-(CH2)f⁆g ist, worin e und f jeweils 2 sind und g 1 ist.
17. Plattierungsbad nach einem der vorhergehenden Ansprüche, worin das Bad auch ein Alkalimetallhydroxid
oder Ammoniumhydroxid in einer Menge enthält, die ausreichend ist, um ein Plattierungbad
mit einem pH von etwa 4 bis etwa 8 zu erhalten.
18. Plattierungsbad nach einem der Ansprüche 1 bis 5, worin das quaternäre Ammoniumpolymer
durch die Formel
⁅N⊕(R)(R)-(CH2)3-N(H)-C(Y)-N(H)-(CH2)b - N⊕(R)(R)-R1⁆n 2nX- IV
gekennzeichnet ist, worin R jeweils für eine Methyl-, Ethyl-, Isopropyl-, Hydroxyethyl oder CH2CH2-(OCH2CH2)cOH-Gruppe steht, a, b und c jeweils unabhängig voneinander für 1 bis etwa 6 stehen,
Y O, S oder NH ist, n mindestens 1 ist, R1 (CH2)d oder ⁅(CH2)e-O-(CH2)f⁆g ist, worin d, e und f jeweils unabhängig voneinander 1 bis etwa 6 sind und g 1 bis
etwa 4 ist und X- ein Halogenidion ist.
19. Plattierungsbad nach Anspruch 18, worin Y in Formel IV O ist und das quaternäre Ammoniumpolymer
ein Molekulargewicht von etwa 350 bis etwa 3.000 aufweist.
20. Plattierungsbad nach Anspruch 18, worin der pH des Bades im Bereich von etwa 5 bis
etwa 7 liegt.
21. Plattierungsbad nach einem der vorhergehenden Ansprüche, worin das Bad etwa 5 bis
etwa 30 g/l Zinn(II)-Ionen und etwa 5 bis etwa 50 g/l Zinkionen enthält.
22. Plattierungsbad nach einem der vorhergehenden Ansprüche, worin das Bad auch mindestens
eine Hydroxypolycarbonsäure mit 3 bis etwa 15 Kohlenstoffatomen oder ein wasserlösliches
Salz davon enthält.
23. Plattierungsbad nach Anspruch 1 umfassend:
(A) etwa 5 bis etwa 30 g/l Zinn(II)-Salz
(B) etwa 5 bis etwa 50 g/l Zinksalz,
(C) etwa 0,5 bis etwa 2,0 g/l quaternäres Ureylenammoniumpolymer, worin das Polymer
hergestellt wird durch Umsetzung von (a) mindestens zwei Mol mindestens eines Diamins
der Formel I
R(R)N-(CH2)a-N(R7)H I
worin R jeweils unabhängig eine Methyl-, Ethyl-, Isopropyl-, Hydroxymethyl-, Hydroxyethyl-
oder CH2CH2-(OCH2CH2)cOH-Gruppe ist, R7 Wasserstoff oder R ist und a 1 bis etwa 6 ist, mit (b) einem Mol Harnstoff zur Herstellung
eines ditertiären Amins, das anschließend (c) einem Dihalogenid der Formel IIIa
X-(CH2)eO(CH2)f-X IIIa
umgesetzt wird, worin X ein Halogenid ist und e und f jeweils unabhängig 2 oder 3
bedeuten und
(D) mindestens zwei Mol mindestens einer Hydroxypolycarbonsäure pro Mol der vereinigten
Zinn(II)- und Zinkionen in dem Plattierungsbad.
24. Plattierungsbad nach Anspruch 23, worin in Formel I R jeweils Methyl ist, R7 Wasserstoff ist, a 3 ist und in Formel IIIa X für Chlor steht und e und f 2 sind.
25. Plattierungsbad nach einem der vorhergehenden Ansprüche, worin die Hydroxypolycarbonsäure
Zitronensäure oder ein wasserlösliches Salz von Zitronensäure ist.
26. Plattierungsbad nach einem der vorhergehenden Ansprüche, weiterhin enthaltend mindestens
ein Polymer eines aliphatischen Amins.
27. Plattierungsbad nach Anspruch 26, worin das Polymer ein Poly(alkylenimin) ist.
28. Plattierungsbad nach Anspruch 27, worin das Poly(alkylenimin) in einer Menge von etwa
0,5 bis etwa 5 g/l vorliegt.
29. Plattierungsbad nach Anspruch 27, worin das Poly(alkylenimin) ein Poly(ethylenimin)
mit einem Molekulargewicht von etwa 100 bis etwa 100.000 ist.
30. Plattierungsbad nach einem der vorhergehenden Ansprüche, weiterhin enthaltend etwa
50 bis etwa 300 g/l mindestens eines leitenden Salzes.
31. Plattierungsbad nach Anspruch 30, worin das leitende Salz ausgewählt ist aus Alkalimetall-
oder Ammoniumhalogeniden, -sulfaten und Gemischen davon.
32. Plattierungsbad nach einem der vorhergehenden Ansprüche, weiterhin beinhaltend etwa
10 bis etwa 30 g/l mindestens eines Metall-Komplexierungsmittel, gekennzeichnet durch die Formel
R3(R4)N-R2-N(R5)R6 VI
worin R3, R4, R5 und R6 jeweils unabhängig voneinander für Alkyl- oder Hydroxyalkylgruppen stehen, mit der
Maßgabe, dass mindestens einer von R3-R6 eine Hydroxyalkylgruppe ist, und R2 eine Hydrocarbylengruppe mit bis zu etwa 10 Kohlenstoffatomen ist.
33. Plattierungsbad nach einem der vorhergehenden Ansprüche, worin das quaternäre Ammoniumpolymer
ein Molekulargewicht von etwa 30 bis etwa 3.000 aufweist.
34. Plattierungsbad nach einem der vorhergehenden Ansprüche, weiterhin enthaltend eine
wirksame Menge mindestens eines ergänzenden Glanzbildners, ausgewählt aus aromatischen
carbonylhaltigen Verbindungen.
35. Verfahren zur elektrolytischen Abscheidung einer glänzenden Zinn-Zink-Legierung auf
einem Substrat, umfassend die E-lektroplattierung des Substrats in dem Plattierungsbad
nach einem der vorhergehenden Ansprüche.
1. Bain de placage aqueux pour l'électrodéposition d'alliages étain-zinc comprenant au
moins un sel stanneux soluble dans le bain, au moins un sel de zinc soluble dans le
bain et un polymère d'ammonium quaternaire choisi parmi un polymère d'uréylène ammonium
quaternaire, un polymère d'imino-uréylène ammonium quaternaire ou un polymère de thio-uréylène
ammonium quaternaire.
2. Bain de placage selon la revendication 1, dans lequel le pH du bain est compris dans
la gamme d'environ 4 à environ 8.
3. Bain de placage selon la revendication 1, dans lequel les sels stanneux et de zinc
sont des sels choisis parmi les sels chlorures, bromures, fluorures, sulfates ou oxydes,
ou leurs mélanges.
4. Bain de placage selon la revendication 1, dans lequel le sel stanneux soluble dans
l'eau est présent en une quantité qui fournit d'environ 1 à environ 100 g/l d'ions
stanneux.
5. Bain de placage selon la revendication 1, dans lequel le sel de zinc soluble dans
l'eau est présent en une quantité qui fournit d'environ 0,1 à environ 80 g/l d'ions
zinc.
6. Bain de placage selon l'une quelconque des revendications précédentes, dans lequel
le polymère d'ammonium quaternaire est préparé par réaction : (a) d'au moins 2 moles
d'une diamine contenant un groupe amine tertiaire et un groupe amine primaire ou secondaire,
avec (b) une mole d'urée, de thiourée ou d'amidine avec l'élimination d'ammoniac pour
former une amine ditertiaire laquelle est ensuite traitée avec (c) un dihalogénure.
7. Bain de placage selon la revendication 6, dans lequel la diamine (a) est caractérisée par la Formule II :
(R)(R)N-(CH2)a-NHC(Y)NH-(CH2)b-N(R)(R) II
dans laquelle chaque R est indépendamment un groupe méthyle, éthyle, isopropyle, hydroxyméthyle,
hydroxyéthyle ou - CH2CH(OCH2CH2)cOH ; a, b et c sont chacun indépendamment 1 à environ 6 ; et Y est O, S ou NH.
8. Bain de placage selon la revendication 7, dans lequel Y est O, et a et b sont 3.
9. Bain de placage selon la revendication 6, dans lequel le dihalogénure (c) est caractérisé par la Formule III :
X-R1-X III
dans laquelle X est un halogénure, et R1 est (CH2)d ou bien -[-(CH2)eO(CH2)f-]-g où d, e et f sont chacun indépendamment de 1 à environ 6, et g est de 1 à environ
4.
10. Bain de placage selon la revendication 9, dans lequel R1 est -[-(CH2)eO(CH2)f-]-g, e et f sont 2 et g est 1.
11. Bain de placage selon l'une quelconque des revendications 1 à 5, dans lequel le polymère
d'ammonium quaternaire est un polymère d'uréylène ammonium quaternaire.
12. Bain de placage selon la revendication 11, dans lequel le polymère d'uréylène ammonium
quaternaire est préparé par réaction : (a) de 2 moles d'une diamine contenant un groupe
amine tertiaire et un groupe amine primaire ou secondaire, avec (b) une mole d'urée
avec l'élimination d'ammoniac pour former une amine ditertiaire laquelle est ensuite
traitée avec (c) un dihalogénure.
13. Bain de placage selon la revendication 12, dans lequel la diamine est caractérisée par la Formule IIa :
(R)(R)N-(CH2)a-NHC(O)NH-(CH2)b-N(R)(R) IIa
dans laquelle chaque R est indépendamment un groupe méthyle, éthyle, isopropyle, hydroxyméthyle,
hydroxyéthyle ou bien - CH2CH(OCH2CH2)cOH, et a, b et c sont chacun indépendamment 1 à environ 6.
14. Bain de placage selon la revendication 13, dans lequel chaque R est un groupe méthyle,
et a et b sont 3.
15. Bain de placage selon la revendication 12, dans lequel le dihalogénure est représenté
par la Formule III :
X-R1-X III
dans laquelle X est un halogénure, et R1 est (CH2)d ou bien -[-(CH2)eO(CH2)f-]-g où d, e et f sont chacun indépendamment de 1 à environ 6, et g est de 1 à environ
4.
16. Bain de placage selon la revendication 15, dans lequel R1 est -[-(CH2)eO(CH2)f-]-g, e et f sont chacun 2 et g est 1.
17. Bain de placage selon l'une quelconque des revendications précédentes, dans lequel
le bain contient aussi un hydroxyde de métal alcalin ou de l'hydroxyde d'ammonium
en une quantité suffisante pour fournir un bain de placage ayant un pH d'environ 4
à environ 8.
18. Bain de placage selon l'une quelconque des revendications 1 à 5, dans lequel le polymère
d'ammonium quaternaire est caractérisé par la Formule IV:
-[-N⊕(R)(R)-(CH2)a-N(H)-C(Y)-N(H)-(CH2)b-N⊕(R)(R)-R1-]-n 2nX-
dans laquelle chaque R est indépendamment un groupe méthyle, éthyle, isopropyle, hydroxyéthyle
ou -CH2CH2(OCH2CH2)cOH; a, b et c sont chacun indépendamment de 1 à environ 6 ; Y est O, S ou NH ; n est
au moins 1 ; R1 est (CH2)d ou -[-(CH2)eO(CH2)f-]-g où d, e et f sont chacun indépendamment de 1 à environ 6, et g est de 1 à environ
4 ; et X- est un ion halogénure.
19. Bain de placage selon la revendication 18, dans lequel Y dans la Formule IV est O,
et le polymère d'ammonium quaternaire a un poids moléculaire d'environ 350 à environ
3000.
20. Bain de placage selon la revendication 18, dans lequel le pH du bain est compris dans
la gamme d'environ 5 à environ 7.
21. Bain de placage selon l'une quelconque des revendications précédentes, dans lequel
le bain contient d'environ 5 à environ 30 g/l d'ions stanneux et d'environ 5 à environ
50 g/l d'ions zinc.
22. Bain de placage selon l'une quelconque des revendications précédentes, dans lequel
le bain contient aussi au moins un acide hydroxy polycarboxylique contenant de 3 à
environ 15 atomes de carbone, ou un sel soluble dans l'eau de celui-ci.
23. Bain de placage selon la revendication 1, comprenant :
(A) d'environ 5 à environ 30 g/l du sel stanneux,
(B) d'environ 5 à environ 50 g/l du sel de zinc,
(C) d'environ 0,5 à environ 2,0 g/l du polymère d'uréylène ammonium quaternaire, où
le polymère est préparé par réaction : (a) d'au moins deux moles d'au moins une diamine
représentée par la Formule I :
R(R)N-(CH2)a-N(R7)H I
dans laquelle chaque R est indépendamment un groupe méthyle, éthyle, isopropyle, hydroxyméthyle,
hydroxyéthyle ou bien -CH2CH(OCH2CH2)cOH, R7 est un atome d'halogène ou R, et a est 1 à environ 6, avec (b) une mole d'urée pour
former une amine ditertiaire laquelle est ensuite traitée avec (c) un dihalogénure
représenté par la Formule IIIa :
X-(CH2)eO(CH2)f-X IIIa
dans laquelle X est un halogénure, et e et f sont chacun indépendamment 2 ou 3, et
(D) au moins deux moles d'au moins un acide hydroxy polycarboxylique par mole d'ions
stanneux et zinc combinés dans le bain de placage.
24. Bain de placage selon la revendication 23, dans lequel, dans la Formule I, chaque
R est un groupe méthyle, R7 est un atome d'hydrogène, a est 3, et dans la Formule IIIa, X est un atome de chlore,
et e et f sont 2.
25. Bain de placage selon l'une quelconque des revendications précédentes, dans lequel
l'acide hydroxy polycarboxylique est l'acide citrique ou un sel soluble dans l'eau
de l'acide citrique.
26. Bain de placage selon l'une quelconque des revendications précédentes contenant aussi
au moins un polymère d'une amine aliphatique.
27. Bain de placage selon la revendication 26, dans lequel le polymère est une poly(alkylèneimine).
28. Bain de placage selon la revendication 27, dans lequel la poly(alkylèneimine) est
présente à raison d'environ 0,5 à environ 5 g/l.
29. Bain de placage selon la revendication 27, dans lequel la poly(alkylèneimine) est
une poly(éthylèneimine) ayant un poids moléculaire d'environ 100 à environ 100.000.
30. Bain de placage selon l'une quelconque des revendications précédentes contenant aussi
d'environ 50 à environ 300 g/l d'au moins un sel conducteur.
31. Bain de placage selon la revendication 30, dans lequel le sel conducteur est choisi
parmi les halogénures et sulfates de métal alcalin ou d'ammonium, et les mélanges
de ceux-ci.
32. Bain de placage selon l'une quelconque des revendications précédentes, contenant aussi
d'environ 10 à environ 30 g/l d'au moins un agent formant un complexe métallique caractérisé par la Formule VI :
R3(R4)N-R2-N(R5)R6 VI
dans laquelle R3, R4, R5 et R6 sont chacun indépendamment des groupes alkyle ou hydroxyalkyle à condition que l'un
au moins des R3 à R6 soit un groupe hydroxyalkyle, R2 est un groupe hydrocarbylène contenant jusqu'à environ 10 atomes de carbone.
33. Bain de placage selon l'une quelconque des revendications précédentes, dans lequel
le polymère d'ammonium quaternaire a un poids moléculaire d'environ 300 à environ
3000.
34. Bain de placage selon l'une quelconque des revendications précédentes contenant aussi
une quantité efficace d'au moins un agent de brillance supplémentaire choisi parmi
des composés aromatiques contenant la fonction carbonyle.
35. Procédé d'électrodéposition d'un alliage étain-zinc brillant sur un substrat qui comprend
l'électrodéposition sur ledit substrat dans le bain de placage selon l'une quelconque
des revendications précédentes.