(19)
(11) EP 1 203 406 A1

(12)

(43) Date of publication:
08.05.2002 Bulletin 2002/19

(21) Application number: 00948212.6

(22) Date of filing: 11.08.2000
(51) International Patent Classification (IPC)7: H01L 21/768, H01L 21/288
(86) International application number:
PCT/IB0001/115
(87) International publication number:
WO 0113/426 (22.02.2001 Gazette 2001/08)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 18.08.1999 US 376954

(71) Applicant: Steag RTP Systems, Inc.
San Jose, CA 95134-2300 (US)

(72) Inventors:
  • TAY, Sing, Pin
    Fremont, CA 94539 (US)
  • HU, Yao, Zhi
    San Jose, CA 95133 (US)
  • SHARANGPANI, Rahul
    Fremont, CA 94538 (US)

(74) Representative: Geyer, Ulrich F., Dr. Dipl.-Phys. et al
WAGNER & GEYER,Patentanwälte,Gewürzmühlstrasse 5
80538 München
80538 München (DE)

   


(54) METHOD OF PRODUCING COPPER FEATURES ON SEMICONDUCTOR WAFERS