| (19) |
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(11) |
EP 1 207 539 A1 |
| (12) |
EUROPEAN PATENT APPLICATION |
| (43) |
Date of publication: |
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22.05.2002 Bulletin 2002/21 |
| (22) |
Date of filing: 18.11.2000 |
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| (51) |
International Patent Classification (IPC)7: H01F 27/29 |
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| (84) |
Designated Contracting States: |
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AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR |
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Designated Extension States: |
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AL LT LV MK RO SI |
| (71) |
Applicant: Hsu, Joseph M.E. |
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Tao Yan Hsien (TW) |
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| (72) |
Inventor: |
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- Hsu, Joseph M.E.
Tao Yan Hsien (TW)
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| (74) |
Representative: Panten, Kirsten et al |
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Reichel & Reichel,
Patentanwälte,
Parkstrasse 13 60322 Frankfurt am Main 60322 Frankfurt am Main (DE) |
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| (54) |
Glazing covered ferrite core electrode terminal of a surface mounting inductor |
(57) A glazing covered ferrite core electrode terminal has a ferrite core (1), a glazing
covered layer (2) coated on a surface of the ferrite core (1), a silver paste layer
(3) disposed on the glazing covered layer (2), a nickel plated layer (4) disposed
on the silver paste layer (3), a solder plated layer (5) disposed on the nickel plated
layer (4), and a solder paste layer (6) disposed on the solder plated layer (5).
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[0001] The present invention relates to a ferrite core electrode terminal. More particularly,
the present invention relates to a ferrite core electrode terminal of a surface mounting
inductor.
[0002] A conventional ferrite core electrode terminal is coated by a silver paste. Since
the surface of the ferrite core electrode terminal has a plurality of gas spacings,
some gas spacings will remain between the ferrite core electrode terminal and the
silver paste. The silver paste will release from the ferrite core electrode terminal
under high temperatures. Furthermore, the surface of the silver paste will be uneven
so that a further soldering result will be poor.
[0003] Object of the present invention is to provide a ferrite core electrode terminal in
which the silver paste is firmly bonded to the surface and will not release from the
ferrite core electrode terminal even at high temperatures.
[0004] The problem is solved by a ferrite core electrode terminal according to claim 1 which
has a glazing covered layer between a silver paste layer and a ferrite core so that
an electroplating solution will not enter the surface of the ferrite core. A preferred
embodiment of the glazing covered ferrite core electrode terminal according to the
invention has a glazing covered layer, a silver paste layer, a nickel paste layer,
a solder plated layer, and a solder paste layer to reinforce a ferrite core.
[0005] A preferred embodiment of the present invention will now be described in detail as
illustrated in the accompanying drawing in which:
FIG. 1 is a schematic view illustrating a ferrite core of a preferred embodiment coated
by a glazing covered layer; and FIG. 2 is a sectional assembly view of a glazing covered
ferrite core electrode terminal of a preferred embodiment in accordance with the present
invention.
[0006] Referring to FIGS. 1 to 3, a glazing covered ferrite core electrode terminal comprises
a ferrite core 1, a glazing covered layer 2 coated on a surface of the ferrite core
1, a silver paste layer 3 disposed on the glazing covered layer 2, a nickel plated
layer 4 disposed on the silver paste layer 3, a solder plated layer 5 disposed on
the nickel plated layer 4, and a solder paste layer 6 disposed on the solder plated
layer 5.
[0007] The glazing covered ferrite core electrode terminal is processed by an infrared reflow
method.
1. A glazing covered ferrite core electrode terminal comprising a ferrite core (1) and
a silver paste layer (2),
characterized in that
a glazing covered layer (2) is coated on the surface of the ferrite core (1) and the
silver paste layer (3) is disposed on the glazing covered layer (2).
2. A glazing covered ferrite core electrode terminal according to claim 1,
characterized in that
a nickel plated layer (4) is disposed on the silver paste layer (3),
a solder plated layer (5) is disposed on the nickel plated layer (4), and
a solder paste layer (6) is disposed on the solder plated layer (5).