(19)
(11) EP 1 212 151 A1

(12)

(43) Date of publication:
12.06.2002 Bulletin 2002/24

(21) Application number: 00948892.5

(22) Date of filing: 21.07.2000
(51) International Patent Classification (IPC)7B08B 3/08, B08B 3/10, B08B 5/00, B08B 9/20, B08B 9/34, C23G 1/00, C23G 1/02
(86) International application number:
PCT/US0020/036
(87) International publication number:
WO 0107/177 (01.02.2001 Gazette 2001/05)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 23.07.1999 US 145350 P

(71) Applicant: SEMITOOL, INC.
Kalispell,Montana 59901 (US)

(72) Inventor:
  • BERGMAN, Eric, J.
    Kalispell, MT 59901 (US)

(74) Representative: Viering, Jentschura & Partner 
Postfach 22 14 43
80504 München
80504 München (DE)

   


(54) PROCESS AND APPARATUS FOR TREATING A WORKPIECE SUCH AS A SEMICONDUCTOR WAFER