SEMICONDUCTOR WAFER LEVEL PACKAGE - Patent 1216487

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EP 1 216 487 A1

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(43)	Date of publication:
	26.06.2002 Bulletin 2002/26

(21)	Application number: 00961925.5

(22)	Date of filing: 15.09.2000

(51)	International Patent Classification (IPC)⁷: H01L 23/04, H01L 23/10, H01L 21/56, H01L 23/29, H01L 21/52, H01L 21/54

(86)	International application number:
	PCT/US0025/315

(87)	International publication number:
	WO 0120/671 (22.03.2001 Gazette 2001/12)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

17.09.1999 US 154400 P

(71)	Applicant: MOTOROLA, INC.
	Schaumburg, IL 60196 (US)

(72)	Inventors:
	XU, DaXue North Plainfield, NJ 07060 (US) HUGHES, Henry, G. Scottsdale, AZ 85254 (US) BERGSTROM, Paul Chandler, AZ 85248 (US) SHEMANSKY, Frank, A., Jr. New Hope, PA 18938 (US) TSOI, Hak-Yam Scottsdale, AZ 85259 (US)

(74)	Representative: Potts, Susan Patricia et al
	Motorola European Intellectual Property OperationsMidpointAlencon Link Basingstoke, Hampshire RG21 7PL Basingstoke, Hampshire RG21 7PL (GB)

(54)	SEMICONDUCTOR WAFER LEVEL PACKAGE