METHOD AND APPARATUS FOR ETCHING AND DEPOSITION USING MICRO-PLASMAS - Patent 1221174

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EP 1 221 174 A1

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(43)	Date of publication:
	10.07.2002 Bulletin 2002/28

(21)	Application number: 00973456.7

(22)	Date of filing: 11.10.2000

(51)	International Patent Classification (IPC)⁷: H01J 37/32

(86)	International application number:
	PCT/US0028/083

(87)	International publication number:
	WO 0127/969 (19.04.2001 Gazette 2001/16)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

12.10.1999 US 158817 P

(71)	Applicant: WISCONSIN ALUMNI RESEARCH FOUNDATION
	MadisonWisconsin 53707-7365 (US)

(72)	Inventors:
	GIANCHANDANI, Yogesh, B. Madison, WI 53717 (US) WILSON, Chester, G. Madison, WI 53706 (US)

(74)	Representative: Price, Nigel John King et al
	J.A. KEMP & CO.14 South SquareGray's Inn London WC1R 5JJ London WC1R 5JJ (GB)

(54)	METHOD AND APPARATUS FOR ETCHING AND DEPOSITION USING MICRO-PLASMAS