SURFACE STRUCTURE AND METHOD OF MAKING, AND ELECTROSTATIC WAFER CLAMP INCORPORATING SURFACE STRUCTURE - Patent 1224687

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(11)

EP 1 224 687 A2

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(88)	Date of publication A3:
	25.10.2001

(43)	Date of publication:
	24.07.2002 Bulletin 2002/30

(21)	Application number: 00968508.2

(22)	Date of filing: 29.09.2000

(51)	International Patent Classification (IPC)⁷: H01L 21/00

(86)	International application number:
	PCT/US0026/910

(87)	International publication number:
	WO 0126/141 (12.04.2001 Gazette 2001/15)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

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Priority:

01.10.1999 US 157398 P
15.09.2000 US 233039 P

(71)	Applicant: Varian Semiconductor Equipment Associates Inc.
	Gloucester, MA 01930 (US)

(72)	Inventor:
	LARSEN, Grant, Kenji Gloucester, MA 01930 (US)

(74)	Representative: Beck, Simon Antony et al
	Withers & Rogers,Goldings House,2 Hays Lane London SE1 2HW London SE1 2HW (GB)

(54)	SURFACE STRUCTURE AND METHOD OF MAKING, AND ELECTROSTATIC WAFER CLAMP INCORPORATING SURFACE STRUCTURE