(19)
(11)
EP 1 228 530 A1
(12)
(43)
Date of publication:
07.08.2002
Bulletin 2002/32
(21)
Application number:
00961480.1
(22)
Date of filing:
31.08.2000
(51)
International Patent Classification (IPC)
7
:
H01L
23/525
,
H01L
23/532
(86)
International application number:
PCT/US0024/087
(87)
International publication number:
WO 0135/462
(
17.05.2001
Gazette 2001/20)
(84)
Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE
(30)
Priority:
05.11.1999
US 434711
(71)
Applicant:
ATMEL CORPORATION
San Jose,California 95131 (US)
(72)
Inventors:
LAM, Ken, M.
Colorado Springs, CO 80906 (US)
KOVATS, Julius, A.
Manitou Springs, CO 80829 (US)
(74)
Representative:
Käck, Jürgen
Kahler, Käck, Fiener,Vorderer Anger 239
86899 Landsberg/Lech
86899 Landsberg/Lech (DE)
(54)
METAL REDISTRIBUTION LAYER HAVING SOLDERABLE PADS AND WIRE BONDABLE PADS