(19)
(11) EP 1 228 530 A1

(12)

(43) Date of publication:
07.08.2002 Bulletin 2002/32

(21) Application number: 00961480.1

(22) Date of filing: 31.08.2000
(51) International Patent Classification (IPC)7H01L 23/525, H01L 23/532
(86) International application number:
PCT/US0024/087
(87) International publication number:
WO 0135/462 (17.05.2001 Gazette 2001/20)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 05.11.1999 US 434711

(71) Applicant: ATMEL CORPORATION
San Jose,California 95131 (US)

(72) Inventors:
  • LAM, Ken, M.
    Colorado Springs, CO 80906 (US)
  • KOVATS, Julius, A.
    Manitou Springs, CO 80829 (US)

(74) Representative: Käck, Jürgen 
Kahler, Käck, Fiener,Vorderer Anger 239
86899 Landsberg/Lech
86899 Landsberg/Lech (DE)

   


(54) METAL REDISTRIBUTION LAYER HAVING SOLDERABLE PADS AND WIRE BONDABLE PADS