<?xml version="1.0" encoding="UTF-8"?>
<!DOCTYPE ep-patent-document PUBLIC "-//EPO//EP PATENT DOCUMENT 1.0//EN" "ep-patent-document-v1-0.dtd">
<ep-patent-document id="EP02002892B8W1" file="02002892.xml" lang="en" country="EP" doc-number="1231240" kind="B8" correction-code="W1" date-publ="20060111" status="c" dtd-version="ep-patent-document-v1-0">
<SDOBI lang="en"><B000><eptags><B001EP>ATBECHDEDKESFRGBGRITLILUNLSEMCPTIE......FI....CY..TR............................</B001EP><B005EP>J</B005EP><B007EP>DIM360 (Ver 1.5  21 Nov 2005) -  2999001/0</B007EP></eptags></B000><B100><B110>1231240</B110><B120><B121>CORRECTED EUROPEAN PATENT SPECIFICATION</B121></B120><B130>B8</B130><B132EP>B1</B132EP><B140><date>20060111</date></B140><B150><B151>W1</B151><B152><date>00000000</date></B152><B153>73</B153><B155><B1551>de</B1551><B1552>Bibliographie</B1552><B1551>en</B1551><B1552>Bibliography</B1552><B1551>fr</B1551><B1552>Bibliographie</B1552></B155></B150><B190>EP</B190></B100><B200><B210>02002892.4</B210><B220><date>20020208</date></B220><B240><B241><date>20020718</date></B241><B242><date>20041222</date></B242></B240><B250>en</B250><B251EP>en</B251EP><B260>en</B260></B200><B300><B310>2001034161</B310><B320><date>20010209</date></B320><B330><ctry>JP</ctry></B330></B300><B400><B405><date>20060111</date><bnum>200602</bnum></B405><B430><date>20020814</date><bnum>200233</bnum></B430><B450><date>20051102</date><bnum>200544</bnum></B450><B452EP><date>20050520</date></B452EP><B480><date>20060111</date><bnum>200602</bnum></B480></B400><B500><B510EP><classification-ipcr sequence="1"><text>C08L  79/08        19850101AFI20020510BHEP        </text></classification-ipcr><classification-ipcr sequence="2"><text>C08L  85/02        19850101ALI20020510BHEP        </text></classification-ipcr><classification-ipcr sequence="3"><text>C08K   5/5399      19900101ALI20020510BHEP        </text></classification-ipcr></B510EP><B540><B541>de</B541><B542>Hitzebeständige Zusammensetzung</B542><B541>en</B541><B542>Heat resistant composition</B542><B541>fr</B541><B542>Composition résistante à la chaleur</B542></B540><B560><B561><text>EP-A- 0 945 478</text></B561><B561><text>EP-A- 1 164 170</text></B561><B561><text>US-A- 3 890 092</text></B561><B561><text>US-A- 5 321 097</text></B561><B561><text>US-A- 5 539 041</text></B561><B562><text>DATABASE WPI Section Ch, Week 199521 Derwent Publications Ltd., London, GB; Class A14, AN 1995-159151 XP002198214 &amp; JP 07 082482 A (FUJITSU LTD), 28 March 1995 (1995-03-28)</text></B562><B562><text>DATABASE CA [Online] CHEMICAL ABSTRACTS SERVICE, COLUMBUS, OHIO, US; ABU-SHANAB, O. L. ET AL: "Polyphosphazene toughened PMR-type thermosets" retrieved from STN Database accession no. 125:277263 XP002198213 &amp; HIGH PERFORM. POLYM. (1996), 8(3), 455-473 ,</text></B562></B560></B500><B700><B720><B721><snm>Shimizu, Toshiyuki,
c/o Toyo Boseki K. K.</snm><adr><str>Research Center,
1-1, Katata 2-chome</str><city>Ohtsu-shi,
Shiga</city><ctry>JP</ctry></adr></B721><B721><snm>Tada, Yuji,
c/o Otsuka Chemical Co., Ltd.</snm><adr><str>Tokushima Res. Lab.,
463, Kagasuno,
Kawauchi-cho</str><city>Tokushima-shi,
Tokushima</city><ctry>JP</ctry></adr></B721></B720><B730><B731><snm>Toyo Boseki Kabushiki Kaisha</snm><iid>01130871</iid><irf>T 2303EU - er</irf><adr><str>2-8, Dojimahama 2-chome, 
Kita-ku</str><city>Osaka-shi,
Osaka 530-8230</city><ctry>JP</ctry></adr></B731></B730><B740><B741><snm>Müller-Boré &amp; Partner 
Patentanwälte</snm><iid>00100651</iid><adr><str>Grafinger Strasse 2</str><city>81671 München</city><ctry>DE</ctry></adr></B741></B740></B700><B800><B840><ctry>AT</ctry><ctry>BE</ctry><ctry>CH</ctry><ctry>CY</ctry><ctry>DE</ctry><ctry>DK</ctry><ctry>ES</ctry><ctry>FI</ctry><ctry>FR</ctry><ctry>GB</ctry><ctry>GR</ctry><ctry>IE</ctry><ctry>IT</ctry><ctry>LI</ctry><ctry>LU</ctry><ctry>MC</ctry><ctry>NL</ctry><ctry>PT</ctry><ctry>SE</ctry><ctry>TR</ctry></B840></B800></SDOBI>
</ep-patent-document>
