(19)
(11) EP 1 234 321 A1

(12)

(43) Date of publication:
28.08.2002 Bulletin 2002/35

(21) Application number: 00978869.6

(22) Date of filing: 22.11.2000
(51) International Patent Classification (IPC)7: H01L 21/00
(86) International application number:
PCT/US0032/198
(87) International publication number:
WO 0103/9252 (31.05.2001 Gazette 2001/22)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI LI
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 22.11.1999 US 166823 P

(71) Applicant: The Board of Trustees of the University of Illinois
Chicago, IL 60612-7277 (US)

(72) Inventors:
  • NEBRIGIC, Dragan, Danilo
    Indian Springs, OH 45011 (US)
  • JEVTITCH, Milan, Marcel
    Cincinnati, OH 45208 (US)
  • HUANG, Chow-Chi
    West Chester, OH 45069 (US)
  • KERR, Kendall, William
    Okeana, OH 45053 (US)

   


(54) ACTIVE PACKAGE FOR INTEGRATED CIRCUIT