(19)
(11) EP 1 236 317 A1

(12)

(43) Date of publication:
04.09.2002 Bulletin 2002/36

(21) Application number: 01963884.0

(22) Date of filing: 09.08.2001
(51) International Patent Classification (IPC)7H04L 12/56
(86) International application number:
PCT/US0125/075
(87) International publication number:
WO 0201/5495 (21.02.2002 Gazette 2002/08)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 11.08.2000 US 225034 P
25.09.2000 US 669184

(71) Applicant: Paion Company, Limited
Burlingame, CA 94101 (US)

(72) Inventors:
  • CHANG, You-Sung
    Yusong-Gu305-701 Taejon (KR)
  • KANG, Moo-Kyung
    Yusong-Gu305-701 Taejon (KR)

(74) Representative: Davies, Simon Robert 
D Young & Co,21 New Fetter Lane
London, EC4A 1DA
London, EC4A 1DA (GB)

   


(54) SYSTEM, METHOD AND ARTICLE OF MANUFACTURE FOR PREPARING A PACKET FOR TRANSMISSION THROUGH A SWITCH FABRIC CHIPSET SYSTEM