(19)
(11) EP 1 238 423 A2

(12)

(88) Date of publication A3:
13.12.2001

(43) Date of publication:
11.09.2002 Bulletin 2002/37

(21) Application number: 00992379.8

(22) Date of filing: 30.11.2000
(51) International Patent Classification (IPC)7: H01L 21/78, B81C 1/00
(86) International application number:
PCT/US0042/507
(87) International publication number:
WO 0104/3169 (14.06.2001 Gazette 2001/24)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(30) Priority: 08.12.1999 US 456466

(71) Applicant: ANALOG DEVICES, INCORPORATED
Norwood, MA 02062-9106 (US)

(72) Inventors:
  • KARPMAN, Maurice
    Brookline, MA 02446 (US)
  • COURAGE, David
    Methuen, MA 01844 (US)
  • XAYSONGKHAM, Somdeth
    Lowell, MA 01852 (US)

(74) Representative: de Beaumont, Michel 
Cabinet Michel de Beaumont1, rue Champollion
38000 Grenoble
38000 Grenoble (FR)

   


(54) METHODS FOR SEPARATING MICROCIRCUIT DIES FROM WAFERS