| (19) |
 |
|
(11) |
EP 1 239 152 B1 |
| (12) |
EUROPEAN PATENT SPECIFICATION |
| (45) |
Mention of the grant of the patent: |
|
18.08.2010 Bulletin 2010/33 |
| (22) |
Date of filing: 05.03.2002 |
|
| (51) |
International Patent Classification (IPC):
|
|
| (54) |
Electric motor driven hydraulic pump
Elektrisch angetriebene Pumpe
Pompe à entraînement électrique
|
| (84) |
Designated Contracting States: |
|
DE ES FR GB IT |
| (30) |
Priority: |
08.03.2001 GB 0105641
|
| (43) |
Date of publication of application: |
|
11.09.2002 Bulletin 2002/37 |
| (73) |
Proprietor: Lucas Industries Limited |
|
West Midlands B90 4LA (GB) |
|
| (72) |
Inventors: |
|
- Lloyd, Tim
Broom,
Warwickshire B50 4GZ (GB)
- Alan-Jones, Keith
Birmingham B23 7DE (GB)
|
| (74) |
Representative: Tranter, Andrew David |
|
Barker Brettell LLP
138 Hagley Road Edgbaston
Birmingham,
West Midlands B16 9PW Edgbaston
Birmingham,
West Midlands B16 9PW (GB) |
| (56) |
References cited: :
EP-A- 0 481 423 DE-A- 4 411 960 US-A- 6 091 174
|
EP-A- 0 733 803 US-A- 6 065 946
|
|
| |
|
|
|
|
| |
|
| Note: Within nine months from the publication of the mention of the grant of the European
patent, any person may give notice to the European Patent Office of opposition to
the European patent
granted. Notice of opposition shall be filed in a written reasoned statement. It shall
not be deemed to
have been filed until the opposition fee has been paid. (Art. 99(1) European Patent
Convention).
|
[0001] This invention relates to improvements in electric motor driven hydraulic pumps,
for example of the type used in hydraulic suspension systems for vehicles.
[0002] Known electrical motor driven hydraulic pumps are controlled by electronic control
units (ECUs) on printed circuit boards (pcbs) which are connected to the motor by
some means. The space envelope of these is not optimised and the best cost cannot
be achieved due to the need for providing a separate housing for the ECU or pcb.
[0003] US-A-6091 174 describes a pump having a casing extended to form a casing for electronics.
[0004] According to our invention we provide an electric motor driven pump as described
in independent claim 1.
[0005] Due to the limitation of space in the area of the chamber, a lead-frame assembly
may be implemented that retains and connects all the high power components, for example
including a power-module of bare die FETs.
[0006] The low power electronics may be mounted on a pcb board which is mounted on and connected
to the lead-frame.
[0007] The low power electronics may be mounted on a traditional FR4 pcb board which is
mounted on and connected to the lead-frame.
[0008] Conveniently the lead-frame also includes a system connector moulded into it. The
lead frame may also include mouldings adapted to guide the connectors of a stator
assembly through the lead frame. The lead frame may also include mouldings adapted
to guide the connectors of a stator assembly through the lead frame, for connection
to the bare die FETs Conveniently the lead frame may include integrally moulded portions
for housing components of a three hall effect sensor.
[0009] A support frame may be provided which together with a closure lid covers the electronics
of the motor.
[0010] Our invention has the advantage of achieving optimum space and conserving costs.
It is not necessary, in this construction, to provide a separate housing for the electronics.
[0011] A clamping means may be provided for releasably connecting the pump sub-assembly
to the electronics sub-assembly.
[0012] The clamping means may secure the support frame to a cup shaped housing of the pump
sub-assembly.
[0013] The pump/rotor sub-assembly may comprise a housing for a pump and a rotor assembly
attached to the pump and sealed by a can within the pump housing. The pump sub-assembly
may comprise a housing for a pump and a rotor assembly attached to the pump and sealed
by a can within the pump housing. On assembly, the support frame may be introduced
to the pump housing to place the stator around the rotor whereby the pump, the stator
and the electronics are sealed by the pump housing, the support frame and the closure
member.
[0014] With our invention the motor with the pump and the motor drive and control electronics
is integrated into a single case, preferably a single cast housing.
[0015] Two embodiments of our invention are illustrated in the accompanying drawings in
which:-
Figure 1 is an end elevation of an electrical motor driven hydraulic pump;
Figure 2 is a section on the line 2-2 of figure 1;
Figure 3 is a perspective view of the pump with part of the casing removed for clarity;
Figure 4 illustrates two sub-assemblies comprising the pump rotor assembly;
Figure 5 is an exploded view of part of Figure 4;
Figure 6 is an exploded view of a second embodiment; and
Figure 7 is a cut-away version of the pump illustrated in Figure 6.
[0016] The electric motor driven hydraulic pump illustrated in Figure 1-5 of the accompanying
drawings comprises two sub-assemblies 1 and 2. A first of the two sub-assemblies is
associated with a casting 3 of cup-shaped outline and the second with a support frame
4 which are clamped together at adjacent ends by a circumferentially extending clamping
band 5. The casting 3 defines a housing for the rotor of an electric motor 6 and a
pump impeller 7. As illustrated the impeller 7 is driven by a drive shaft 8 driven
by the rotor 9 of the motor and which is enclosed within a stainless steel can 10
which the stator 11 surrounds. The can is preferably manufactured from a non-magnetic
material preferably stainless steel.
[0017] The open end of the casting 3 is closed by the support frame 4 by the clamping action
of the band 5 as described above. The support frame is of die cast construction and
defines a mounting for a lead frame 12, the support frame 4 and the lead frame 12
include connecting paths from the motor to the electronics for controlling operation
of motor 6. The lead frame provides a mounting for a circuit board 14 and also includes
a connector 13. The lead frame 12 also includes a moulded bare die FET module indicated
at 12' and integrally moulded portions 12" housing a hall effect sensor. The lead
frame has additional mouldings 12"' each having an opening through which respective
connectors 11' from the motor stator can pass to be joined with the FET leads. The
lead frame and electronics are enclosed within an end cover 15.
[0018] The sub-assembly 1 is built by inserting a further assembly comprising the pump impeller
7 and associated components, the shaft 8, the rotor 9, the pump housing 16 and the
can 10. The further assembly being located within the housing 3 and then being secured
with a circlip. The completed sub-assembly 1 then forms a stand alone sealed unit
in which all the elements of the pump can be hydraulically tested prior to final assembly
with the electronics.
[0019] The sub-assembly 2 is assembled by mounting the board 14 carrying the electronics
on the lead frame 12 and then locating the connector 13 of the lead frame through
the opening 4' in the support frame 4. Once mounted in this position the bare die
FET module is exposed on the side of the lead frame adjacent the support member 4
such as to abut the spigot 4" on the support member 4. A thermal compound may be applied
between the abutting surfaces.
[0020] The stator connectors 11' are inserted through respective openings in the support
frame 4 and the lead frame 12 to be joined with the FET leads in known manner. The
support frame 4 is configured to support the stator 11 in its final position on sub-assembly
2.
[0021] The final part of sub-assembly 2 is to mount the cover 15 in place by way of a snap
fit connection with the edge of the lead frame 12. The completed sub-assembly 2 then
forms a stand alone unit in which the electronics and stator can be tested prior to
final assembly with the pump assembly.
[0022] As the sub-assemblies 1 and 2 are brought together, the stator 11 of assembly 2 is
assembled such as to surround the can 10 of assembly 1. Finally, the assembly is completed
by securing the clamping band 5 in position to clamp mating faces of the casting 3
and the lead frame 2 into engagement. In this final position, it is notable that the
bare die FET module on the lead frame 12 is in contact with the support frame 4 as
described above, which serves to help dissipate heat.
[0023] The construction described above has the advantage that each of the two sub-assemblies
1 and 2 can be manufactured separately, and tested individually. Each of the two sub-assemblies
1 and 2 can be manufactured at different locations and then both supplied to the customer
for final assembly, for example on a vehicle during production. The two sub-assemblies
can simply be assembled together and then clamped with mating faces in engagement
as described above.
[0024] In the modified construction illustrated in Figures 6 and 7 the position of the circuit
board 14 and the mounting lead frame 12 are the same as for the embodiments Figure
1-5, but a separate FET module 17 is used.
[0025] It will be appreciated that whilst the sub-assembly 1 can be fully tested for hydraulic
integrity in order to test the rotor 9 a slave stator locked to a suitable power source
may be employed.
[0026] In an alternative embodiment (not shown) the stator could be part of sub-assembly
1 and the electronics alone would be a separate sub-assembly.
1. An electric motor driven hydraulic pump in which the casing of the motor is extended
to include a chamber in which the electronics can be housed, the casing being constructed
appropriately to be split in order to define a pump rotor sub-assembly (1) and an
electronics sub-assembly (2) which can be tested separately and then joined together
by use of simple interconnections, the electronics sub-assembly (2) comprises a support
frame (4), a lead frame (12) carrying power components (12), a printed circuit board
carrying electronic components (14), and a closure member characterised in that the electronic sub-assembly (2) includes the motor stator windings which are supported
by the support frame and connected to the lead frame.
2. A pump according to claim 1 in which the lead-frame assembly (12) retains and connects
all the high power components.
3. A pump according to claim 2 in which the high power components comprise a power-module
of bare die FETs(12').
4. A pump according to claim 2 or claim 3 in which the low power electronics are mounted
on the pcb board which is mounted on and connected to the lead-frame (12).
5. A pump according to any one of claims 2 to 4 in which the lead-frame (12) includes
a single connector (13) moulded into it.
6. A pump according to any one of claims 2 to 5 in which the lead-frame (12) includes
mouldings adapted to guide the connectors (11') of a stator assembly (11) through
the lead-frame (12).
7. A pump according to any one of claims 2 to 6 in which the lead-frame (12) also includes
integrally moulded portions for housing components of a three hall effect sensor.
8. A pump according to any previous claim in which a support frame (4) is provided which,
together with a closure lid, covers the electronics of the motor.
9. A pump according to any preceding claim in which a clamping means (5) is provided
for releasably connecting the pump sub-assembly (1) to the electronics sub-assembly
(2).
10. A pump according to claim 10 when dependant on claim 8 in which the clamping means
(5) secures the support frame (4) to a cup-shaped housing (3) of the pump sub-assembly
(1).
11. A pump according to any one of claims 1 to 10 in which the pump sub-assembly (1) comprises
a housing (3) for a pump, and a rotor assembly (9) attached to the pump and sealed
by a can within the pump housing (3).
12. A pump according to claim 10 or 11 in which the support frame is adapted to be, on
assembly of the pump, introduced to the pump housing (1) to place the stator (11)
around the rotor whereby the pump, the stator (11) and the electronics are sealed
by the pump housing, the support frame (4) and the closure member.
1. Elektromotorgetriebene Hydraulikpumpe, bei der das Motorgehäuse verlängert ist, um
eine Kammer einzuschließen, in der die Elektronik untergebracht werden kann, wobei
das Gehäuse geeignet konstruiert ist, um geteilt zu werden, um eine Pumpen-Rotor-Unterbaugruppe
(1) und eine Elektronik-Unterbaugruppe (2) zu bilden, die separat getestet und dann
unter Verwendung einfacher Verbindungen miteinander verbunden werden können, wobei
die Elektronik-Unterbaugruppe (2) ein Gestell (4), einen Leistungsbauelemente (12)
tragenden Leitungsrahmen (12), eine elektronische Bauteile (14) tragende Leiterplatte
und ein Verschlussbauteil aufweist, dadurch gekennzeichnet, dass die Elektronik-Unterbaugruppe (2) die Statorwicklungen des Motors enthält, die vom
Gestell abgestützt und mit dem Leitungsrahmen verbunden sind.
2. Pumpe nach Anspruch 1, bei der die Leitungsrahmenbaugruppe (12) alle Leistungsbauelemente
fixiert und verbindet.
3. Pumpe nach Anspruch 2, bei der die Leistungsbauelemente ein Leistungsmodul aus offenliegenden
FET-Bausteinen (12') umfasst.
4. Pumpe nach Anspruch 2 oder Anspruch 3, bei der die Niederspannungselektronik auf der
Leiterplatte montiert ist, die auf dem Leitungsrahmen (12) angebracht und mit ihm
verbunden ist.
5. Pumpe nach einem der Ansprüche 2 bis 4, bei der der Leitungsrahmen (12) einen in ihn
eingeformten einzelnen Steckverbinder (13) umfasst.
6. Pumpe nach einem der Ansprüche 2 bis 5, bei der der Leitungsrahmen (12) Formstücke
aufweist, die Steckverbinder (11') einer Statoranordnung (11) durch den Leitungsrahmen
(12) zu führen vermögen.
7. Pumpe nach einem der Ansprüche 2 bis 6, bei der der Leitungsrahmen (12) ferner integral
geformte Teile für Gehäusebestandteile eines Dreier-Halleffektsensors umfasst.
8. Pumpe nach einem der vorhergehenden Ansprüche, bei dem ein Gestell (4) vorhanden ist,
das zusammen mit einem Schließdeckel die Elektronik des Motors abdeckt.
9. Pumpe nach einem der vorhergehenden Ansprüche, bei der eine Klemmeinrichtung (5) zum
lösbaren Verbinden der Pumpen-Unterbaugruppe (1) mit der Elektronik-Unterbaugruppe
(2) vorhanden ist.
10. Pumpe nach Anspruch 10 in seiner Abhängigkeit vom Anspruch 8, bei der die Klemmeinrichtung
(5) das Gestell (4) an einem becherförmigen Gehäuse (3) der Pumpen-Unterbaugruppe
(1) befestigt.
11. Pumpe nach einem der Ansprüche 1 bis 10, bei der die Pumpen-Unterbaugruppe (1) ein
Gehäuse (3) für eine Pumpe umfasst und eine Rotoranordnung (9), die an der Pumpe befestigt
und durch eine Dose innerhalb des Pumpengehäuses (3) abgedichtet ist.
12. Pumpe nach Anspruch 10 oder 11, bei der das Gestell dazu eingerichtet ist, beim Zusammenbau
der Pumpe in das Pumpengehäuse (1) eingeführt zu werden, um den Stator (11) um den
Rotor zu platzieren, wodurch die Pumpe, der Stator (11) und die Elektronik durch das
Pumpengehäuse, das Gestell (4) und das Verschlussbauteil abgedichtet sind.
1. Pompe hydraulique entraînée par moteur électrique dans laquelle le boîtier du moteur
est étendu pour inclure une chambre dans laquelle l'électronique peut être longée,
le boîtier étant construit de manière appropriée pour être partagé afin de définir
un sous-ensemble de rotor de pompe (1) et un sous-ensemble d'électronique (2) qui
peuvent être testés séparément et ensuite assemblés à l'aide de simples interconnexions,
le sous-ensemble d'électronique (2) comprenant un châssis de support (4), une grille
de connexion (12) supportant les composants de puissance (12), une carte de circuit
imprimé supportant les composants électroniques (14) et un élément de fermeture, caractérisée en ce que le sous-ensemble d'électronique (2) comprend des enroulements de stator de moteur
qui sont supportés par le châssis de support et raccordés à la grille de connexion.
2. Pompe selon la revendication 1, dans laquelle l'ensemble de grille de connexion (12)
retient et raccorde tous les composants de courant fort.
3. Pompe selon la revendication 2, dans laquelle les composants de courant fort comprennent
un module de puissance de transistors à effet de champ (12') nus.
4. Pompe selon la revendication 2 ou la revendication 3, dans laquelle l'électronique
à faible courant est montée sur la carte PCB qui est montée sur et raccordée à à grille
de connexion (12).
5. Pompe selon l'une quelconque des revendications 2 à 4, dans laquelle la grille de
connexion (12) comprend un seul connecteur (13) moulé dans cette dernière.
6. Pompe selon l'une quelconque des revendications 2 à 5, dans laquelle la grille de
connexion (12) comprend des moulages adaptés pour guider les connecteurs (11') de
l'ensemble de stator (11) à travers la grille de connexion (12).
7. Pompe selon l'une quelconque des revendications 2 à 6, dans laquelle la grille de
connexion (12) comprend également des parties moulées de manière solitaire pour loger
les composants d'un capteur à trois effets hall.
8. Pompe selon l'une quelconque des revendications précédentes, dans laquelle on prévoit
un châssis de support (4) qui, conjointement à un couvercle de fermeture, recouvre
l'électronique du moteur.
9. Pompe selon l'une quelconque des revendications précédentes, dans laquelle on prévoit
des moyens de serrage (5) pour raccorder de manière amovible le sous-ensemble de pompe
(1) au sous-ensemble d'électronique (2).
10. Pompe selon la revendication 10, lorsqu'elle dépend de la revendication 8, dans laquelle
les moyens de serrage (5) fixent le châssis de support (4) sur un boîtier (3) en forme
de coupelle du sous-ensemble de pompe (1).
11. Pompe selon l'une quelconque des revendications 1 à 10, dans laquelle le sous-ensemble
de pompe (1) comprend un boîtier (3) pour une pompe, et un ensemble de rotor (9) fixé
sur la pompe et étanche grâce à une boîtier métallique à l'intérieur du boîtier de
pompe (3).
12. Pompe selon la revendication 10 ou 11, dans laquelle le châssis de support est adapté,
sur l'ensemble de la pompe, pour être introduit dans le boîtier de pompe (1) afin
de placer le stator (11) autour du rotor moyennant quoi, la pompe, le stator (11)
et l'électronique sont hermétiquement enfermés par le boîtier de pompe, le châssis
de support (4) et l'élément de fermeture.
REFERENCES CITED IN THE DESCRIPTION
This list of references cited by the applicant is for the reader's convenience only.
It does not form part of the European patent document. Even though great care has
been taken in compiling the references, errors or omissions cannot be excluded and
the EPO disclaims all liability in this regard.
Patent documents cited in the description