(19)
(11) EP 1 249 863 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(48) Corrigendum issued on:
15.01.2003 Bulletin 2003/03

(43) Date of publication:
16.10.2002 Bulletin 2002/42

(21) Application number: 01958398.8

(22) Date of filing: 22.08.2001
(51) International Patent Classification (IPC)7H01L 21/60
(86) International application number:
PCT/JP0107/183
(87) International publication number:
WO 0201/7379 (28.02.2002 Gazette 2002/09)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(30) Priority: 25.08.2000 JP 2000255352

(71) Applicant: TORAY INDUSTRIES, INC.
Tokyo 103-8666 (JP)

(72) Inventors:
  • OGURA, Mikihiro
    Kusatsu-shi, Shiga 525-0037 (JP)
  • KIGOSHI, Syouji
    Otsu-shi, Shiga 520-0865 (JP)
  • TOKUNAGA, Masami
    Otsu-shi, Shiga 520-0842 (JP)
  • TSUTSUMI, Yasuaki
    Otsu-shi, Shiga 520-0842 (JP)
  • KAMEI, Ryuichi
    Kyoto-shi, Kyoto 607-8088 (JP)
  • SHIMIZU, Ken
    Kyoto-shi, Kyoto 607-8088 (JP)

(74) Representative: Coleiro, Raymond et al
MEWBURN ELLIS York House 23 Kingsway
London WC2B 6HP
London WC2B 6HP (GB)

   


(54) SEMICONDUCTOR JOINING SUBSTRATE-USE TAPE WITH ADHESIVE AND COPPER-CLAD LAMINATE SHEET USING IT


(57) The present invention relates to an adhesive-backed tape for semiconductors which is characterized in that it is composed of a laminate of an insulating film layer having the following characteristics (1) and (2) and at least one adhesive agent layer in the semi-cured state.
  • (1) The coefficient of linear expansion in the film transverse direction (TD) at 50-200°C is 17-30 ppm/°C
  • (2) The tensile modulus of elasticity is 6-12 GPa

By means of this construction the present invention can provide, on an industrial basis, an adhesive-backed tape suitable for producing semiconductor devices, together with copper-clad laminates, semiconductor connecting substrates and semiconductor devices employing said tape, and it enables the reliability of semiconductor devices for high density mounting to be enhanced.