(19)
(11) EP 1 252 484 A2

(12)

(88) Date of publication A3:
22.11.2001

(43) Date of publication:
30.10.2002 Bulletin 2002/44

(21) Application number: 00991691.7

(22) Date of filing: 30.11.2000
(51) International Patent Classification (IPC)7G01F 1/684
(86) International application number:
PCT/US0032/663
(87) International publication number:
WO 0104/0738 (07.06.2001 Gazette 2001/23)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 30.11.1999 US 168261 P

(71) Applicant: California Institute of Technology
Pasadena, CA 91125 (US)

(72) Inventors:
  • TAI, Yu-Chong
    Pasadena, CA 91107 (US)
  • WU, Shuyun,California Institute of Technology
    Pasadena, CA 91125 (US)
  • LIN, Qiao,California Institute of Technology
    Pasadena, CA 91125 (US)

(74) Representative: Lloyd, Patrick Alexander Desmond et al
Reddie & Grose16 Theobalds Road
London WC1X 8PL
London WC1X 8PL (GB)

   


(54) MICROELECTROMECHANICAL SYSTEM SENSOR ASSEMBLY