(19)
(11) EP 1 253 636 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(48) Corrigendum issued on:
12.03.2003 Bulletin 2003/11

(43) Date of publication:
30.10.2002 Bulletin 2002/44

(21) Application number: 01967704.6

(22) Date of filing: 17.09.2001
(51) International Patent Classification (IPC)7: H01L 23/40
(86) International application number:
PCT/JP0108/053
(87) International publication number:
WO 0202/5731 (28.03.2002 Gazette 2002/12)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(30) Priority: 19.09.2000 JP 2000283018
09.08.2001 JP 2001242874

(71) Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Kadoma-shi, Osaka 571-8501 (JP)

(72) Inventors:
  • SEGI, Hiroshi
    Matsusaka-shi, Mie 515-0102 (JP)
  • TANIGUCHI, Toshiyuki
    Matsusaka-shi, Mie 515-0824 (JP)
  • MURAKAMI, Takaharu
    Matsusaka-shi, Mie 515-0045 (JP)

(74) Representative: Balsters, Robert et al
Novagraaf SA 25, Avenue du Pailly
1220 Les Avanchets - Geneva
1220 Les Avanchets - Geneva (CH)

   


(54) ELECTRONIC EQUIPMENT


(57) Electronic equipment comprising a wiring board, electronic component mounted on the wiring board and having a heat dissipation portion on the surface thereof, and an insulating heat dissipation plate thermally connected to the electronic component, wherein the heat dissipation portion is directly connected to the heat dissipation plate with heat conductive bonding materials. The heat dissipation plate is a ceramic plate having at least one land for connecting electronic component or a resin plate containing highly heat conductive material. By directly connecting the insulating heat dissipation plate to electronic component generating heat, an insulating plate between the heat dissipation plate and the electronic component used in a conventional method becomes not required. Consequently, it is possible to enhance a heat dissipation effect of electronic component in electronic equipment.