(19)
(11) EP 1 260 126 A2

(12)

(88) Date of publication A3:
07.02.2002

(43) Date of publication:
27.11.2002 Bulletin 2002/48

(21) Application number: 01904457.7

(22) Date of filing: 15.02.2001
(51) International Patent Classification (IPC)7: H05K 13/00, H01L 21/00
(86) International application number:
PCT/JP0101/062
(87) International publication number:
WO 0106/2062 (23.08.2001 Gazette 2001/34)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(30) Priority: 17.02.2000 JP 2000039160
23.02.2000 JP 2000045837

(71) Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
Kadoma-shi,Osaka 571-8501 (JP)

(72) Inventors:
  • TSUJI, Shinjiro
    Nara-shi, Nara 631-0035 (JP)
  • NISHIMOTO, Tomotaka
    Hirakata-shi, Osaka 573-0007 (JP)
  • MURATA, Takahiko
    Soraku-gun, Kyoto 619-0224 (JP)
  • IDA, Masayuki
    Moriguchi-shi, Osaka 570-0002 (JP)

(74) Representative: Eisenführ, Günther, Dipl.-Ing. 
Eisenführ, Speiser & Partner,Martinistrasse 24
28195 Bremen
28195 Bremen (DE)

   


(54) COMPONENT MOUNTING APPARATUS AND COMPONENT MOUNTING METHOD, AND, RECOGNITION APPARATUS FOR COMPONENT MOUNT PANEL, COMPONENT MOUNTING APPARATUS FOR LIQUID CRYSTAL PANEL, AND COMPONENT MOUNTING METHOD FOR LIQUID CRYSTAL PANEL