Copper based alloy featuring precipitation hardening and solid-solution hardening - Patent 1264905

(19)

(11)

EP 1 264 905 A3

(12)	EUROPEAN PATENT APPLICATION

(88)	Date of publication A3:
	18.12.2002 Bulletin 2002/51

(43)	Date of publication A2:
	11.12.2002 Bulletin 2002/50

(21)	Application number: 02018195.4

(22)	Date of filing: 21.08.1998

(51)	International Patent Classification (IPC)⁷: C22C 9/02, C22C 9/06

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30)

Priority:

05.09.1997 US 57779

(62)	Application number of the earlier application in accordance with Art. 76 EPC:
	98943252.1 / 1021575

(71)	Applicant: The Miller Company
	Meriden, CT 06450-1010 (US)

(72)	Inventors:
	Mandle, David, H. C/O Miller Company Meriden, CT 06450-1010 (US) Farquharson, Daniel,D C/O Miller Company Meriden, CT 06450-1010 (US)

(74)	Representative: Albrecht, Thomas, Dr. et al
	Kraus & Weisert, Thomas-Wimmer-Ring 15 80539 München 80539 München (DE)

(54)	Copper based alloy featuring precipitation hardening and solid-solution hardening

(57) A phosphor bronze alloy consisting of:

0.4 to 3.0wt% Ni, 1.0 to 11.0wt% Sn, 0.1 to 1.0wt% Si, 0.01 to 0.06wt% P, the remainder being substantially Cu. The alloy is suitable for electrical lead conductors and for electrical or electronic interconnections.