VACUUM PACKAGE FABRICATION OF MICROELECTROMECHANICAL SYSTEM DEVICES WITH INTEGRATED CIRCUIT COMPONENTS - Patent 1272422

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EP 1 272 422 A2

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(88)	Date of publication A3:
	07.03.2002

(43)	Date of publication:
	08.01.2003 Bulletin 2003/02

(21)	Application number: 01906897.2

(22)	Date of filing: 01.02.2001

(51)	International Patent Classification (IPC)⁷: B81B 7/00

(86)	International application number:
	PCT/US0103/371

(87)	International publication number:
	WO 0105/6921 (09.08.2001 Gazette 2001/32)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

02.02.2000 US 496820
02.02.2000 US 496826

(71)	Applicant: Raytheon Company
	Lexington,Massachusetts 02421 (US)

(72)	Inventors:
	GOOCH, Roland, W. Dallas, TX 75231 (US) SCHIMERT, Thomas, R. Ovilla, TX 75154 (US)

(74)	Representative: Lawrence, John
	Barker Brettell 138 Hagley RoadEdgbaston Birmingham B16 9PW Birmingham B16 9PW (GB)

(54)	VACUUM PACKAGE FABRICATION OF MICROELECTROMECHANICAL SYSTEM DEVICES WITH INTEGRATED CIRCUIT COMPONENTS