(19)
(11) EP 1 274 783 A2

(12)

(88) Date of publication A3:
16.05.2002

(43) Date of publication:
15.01.2003 Bulletin 2003/03

(21) Application number: 01928447.0

(22) Date of filing: 10.04.2001
(51) International Patent Classification (IPC)7: C08K 5/3437, C08G 59/68, C08G 65/10, C09J 163/00, C09J 7/00
(86) International application number:
PCT/US0111/695
(87) International publication number:
WO 0107/9374 (25.10.2001 Gazette 2001/43)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 18.04.2000 JP 2000116518

(71) Applicant: 3M Innovative Properties Company
Saint Paul, MN 55133-3427 (US)

(72) Inventors:
  • HATA, Michiru
    Sagamihara-city, Kanagawa 229-0032 (JP)
  • HIROSHIGE, Yuji
    Hachioji-city, Tokyo 192-0363 (JP)
  • YAMAGUCHI, Hiroaki
    Yamato-city, Kanagawa 242-0003 (JP)
  • KITAMURA, Tetsu
    Kawasaki-City, Kanagawa 214-0033 (JP)

(74) Representative: Meyers, Hans-Wilhelm, Dr.Dipl.-Chem. et al
Patentanwältevon Kreisler-Selting-WernerPostfach 10 22 41
50462 Köln
50462 Köln (DE)

   


(54) STABILIZED CATIONICALLY POLYMERIZABLE COMPOSITION, AND ADHESIVE FILM AND CONDUCTOR CIRCUIT COMPRISING THE SAME