Field of the Invention
[0001] The invention relates to the field of opto-electronics and more particularly to a
connector for one or more optical fibers on a circuit board. Moreover, the invention
relates to a circuit board with one or more high-speed electronic components attached
thereon, which are connected by means of optical fibers.
Background of the Invention
[0002] For high speed electronic applications, the electrical interconnections are the bottleneck
on a printed circuit boards (PCB) which limit data transfer rate between electronic
components and from electronic components to the backplane. On the other hand, it
can be expected that electronic components such as micro-processors or application
specific integrated circuits (ASICs) become faster and faster in the next few years.
An extrapolation of the clock rate of such electronic components plotted against a
time scale is shown in figure 1 which is a diagram of the International Technology
Roadmap for Semiconductors.
[0003] A widely accepted technical limit of the product of bitrate and distance for electrical
interconnections is about 2.5GBit/sec/meter. Therefore, higher transmission rates
will be realized in the future with optical interconnection technology.
[0004] At present, there are different approaches known to realize optical interconnections.
Some proposals are based on polymer planar multimode waveguides on a carrier foil
which is able to be laminated within a standard multilayer PCB. This solution is quite
near to the standard manufacturing process of a PCB and includes also surface mount
technology for the board. A disadvantage is that such optical-electrical PCBs as well
as surface mountable optical-electrical components are not yet available today, even
not as research prototypes. It will thus take several years from now to develop these.
[0005] Another possible approach shown in figure 2 consists of a high speed board which
has an optical overlay to realize the optical interconnections. High speed ASICs which
process the data are closely located to the optical-electrical components such as
Parallel Optical Links (POLs). The bitrate from and to the POLs can be up to 30GBit/sec
or even more. The optical overlay connects the POLs with either the backplane or makes
interconnections between them.
[0006] In practice, the board will be manufactured in a standard process. In a further processing
step, an optical overlay makes the optical interconnects as illustrated in figure
3, which is a picture from the company 3M. In this figure the overlay may be a foil
with polymer waveguides but can also be a multiwire flexfoil, i.e., a flexible foil
with optical fibers attached thereon. All components (POLs, Flexfoil, MT-Connector,
and Optical Backplane connector for MT connector) needed for such an optical overlay
are today available on the market as commercial products. Therefore, the shown optical
interconnect on PCB via multiwire technology is available but is relative expensive,
today. The reason for that is given in the mounting process of the MT-connector (MT:
multi-fiber). For mounting an MT connector, the primary coating of the ribbon fiber
has to be removed. However, an optical fiber without primary coating is very fragile
which makes handling extremely difficult.
Brief Description of the Invention
[0007] It is therefore an object of the present invention to provide a connector for one
or more optical fibers which eases mounting and handling and therefore allows manufacturing
of high-speed circuit boards at commercially acceptable costs. Further objects of
the present invention are to provide a corresponding circuit board and method of producing
such connector.
[0008] These and other objects that appear below are achieved by a connector for one or
more optical fibers which has a ferrule into which the optical fibers are glued directly
with their outer cladding. No stripping of the fibers is required any longer before
gluing them to the ferrule and thus, the difficulty of the fragility of the stripped
fibers is overcome.
[0009] Advantages of the present invention include that the over-all costs are reduced due
to easier handling and better yield of manufacturing process.
Brief description of the Drawings
[0010] Preferred embodiments of the present invention will now be described with reference
to the accompanying drawings in which
Figure 1 shows in a diagram the clock rate of electrical semiconductor components
against a time scale;
figure 2 shows a printed circuit board with optical interconnections;
figure 3 shows a printed circuit board with an optical overlay forming the optical
interconnections;
figures 4a-c show three different ferrules with optical fibers glued thereto; and
figure 5 shows a ferrule with optical fibers after gluing.
Detailed Description of the Invention
[0011] Figures 4a to 4c show a connector according to the present invention. It comprises
a ferrule E into which optical fibers F are glued. The fibers F is a multimode fiber
with a core having a diameter of 62,5 micron (1 micron = 1/1000 mm), an inner cladding
surrounding the core and having a diameter of 125 microns, and a primary coating surrounding
the inner cladding and having a diameter of 180 microns. The core and inner cladding
are made of silica (glass). The inner cladding has a refractive index slightly higher
than the refractive index of the core. The primary coating is an organic material
to protect the fiber against breakage or other kind of damage.
[0012] Conventional fibers are manufactured by drawing them under high temperature from
a silica bait rod or tube called a blank. During the drawing process, the fiber is
coated with an epoxy resin to form the primary coating. This primary coating varies
in thickness typically about ±10 microns.
[0013] A basic idea of the present invention consists in gluing the fibers F directly into
the ferrule E without removing the primary coating prior to gluing. This saves one
processing step and the handling of the fiber is no problem. To do so, it is necessary
to have a special fiber having a primary coating with smaller tolerances. As explained
above, typical commercially available fibers have a tolerance of the outer diameter
of the primary coating of ±10 microns. If such fibers are glued with their primary
coating directly into a ferrule, the optical insertion loss would be unacceptable
high.
[0014] Therefore, another basic idea of the invention is to use optical fibers with an improved
tolerance of their outer diameter. Such special fibers can be produced by simply reducing
the drawing speed during manufacturing. This allows to better control the coating
step so that a tolerance of ±2 microns or even ±1 micron is achieved. Typical drawing
speed of the fiber during manufactory is about 10% of the conventional drawing speed.
Such a fiber has accurate enough dimensions for gluing it directly into a ferrule
without removing the primary coating, first.
[0015] As manufacturing fibers at lower production speed would certainly increase the costs
per meter, the invention is based on a tradeoff between increased fiber price and
reduced mounting costs of the connector. The invention is further based on the recognition
that the increased fiber price is over-compensated by savings due to the simplified
mounting step, since for circuit board applications only few meters of fiber are required.
[0016] The ferrule E in figure 4a has V-grooves for the several fibers. The fibers F are
glued directly into the corresponding V-grooves without stripping off the primary
coating. This is the best solution and results in the most accurate connector.
[0017] Figures 4b and 4c show cheaper solutions but overall fiber location tolerance is
higher as compared to figure 4a which leads to higher insertion loss, but which could
also be tolerated in some applications. In figure 4b, the fibers are glued directly
into one large gap in the ferrule. In figure 4c, the ferrule has four smaller gaps,
each with a dimension to receive three fibers. All three ferrules have holes H for
guide pins from the corresponding counterpart socket on the circuit board.
[0018] Figure 5 shows a ferrule E with twelve fibers F attached to it after gluing. The
twelve fibers lay in a gap of the ferrule E. The gap is filled above the fibers with
a UV-curable resin G. To advantage, conventional fiber ribbons with twelve optical
fibers can be used. Not shown in the figures are conventional outer parts and housing
of the connector, which obviously will be assembled around the ferrule to build the
complete connector.
[0019] Figure 2 shows a printed circuit board with several ASICs attached thereon. Conventional
Parallel Optical Link modules (POL) are arranged close to some of the ASICs. These
allow optical interconnections and have optical sockets which correspond to the ferrules
of the optical connectors presented above. Several fiber ribbons with such connectors
are arranged on a multiwire flexfoil to form an overlay for a circuit board as shown
in figure 3. The connectors are plugged to the corresponding sockets of the POLs on
the circuit board.
[0020] Having now described several embodiments of the invention, it should be understood
that the invention is not limited to the details of the embodiments.
[0021] On the contrary, changes and equivalents of material, design and manufacturing steps
are apparent to those skilled in the art having understood the above principles. Without
claiming completeness, following changes could for example be envisaged. Use of plastic
fibers instead of silica fibers; use of different kind of glue; one or more single
fibers instead of a fiber ribbon; use of loose fibers instead of flexfoil; higher
or lower tolerances of the outer fiber diameter, depending on the tolerable coupling
losses; different form and size of connector and ferrule, circuit board with any kind
of high-speed electrical and electro-optical components; and many more.
[0022] Compared to conventional manufacturing methods which remove fiber coating, the present
invention may have slightly higher optical insertion loss but is considerably cheaper.
Compared to an optical-electrical PCB having optical waveguides inside the PCB, the
invention offers smaller optical insertion loss and all required components are in
principle available today.
1. A connector for one or more optical fibers (F) comprising a fiber core, an inner cladding
surrounding said core and a primary coating surrounding said inner cladding, said
connector comprising a ferrule (E) into which said one or more optical fibers (F)
are glued, characterized in that said one or more fibers (F) are glued with their primary coating into said ferrule
(E).
2. A connector according to claim 1, wherein said primary coating of the fibers (F) has
a tolerance of ±2 microns or less, preferably of ±1 microns, in diameter.
3. A connector according to claim 1, wherein said optical fibers (F) are glued into said
ferrule (E) using an UV-curable resin (G).
4. A connector according to claim 1, wherein said optical fibers (F) are arranged to
a ribbon fiber.
5. A circuit board comprising one or more electrical high-speed components (ASIC 1-5)
connected by means of optical fibers (F) comprising a fiber core, an inner cladding
surrounding said core and a primary coating surrounding said inner cladding, characterized in that said optical fibers (F) being glued with their primary coating into a ferrule (E)
and said ferule being connected to a corresponding counterpart on the circuit board.
6. A circuit board according to claim 5, wherein said optical fibers are attached on
a flexible foil building an overlay (OL) on top of the circuit board.
7. An optical overlay (OL) for a circuit board, comprising a flexible foil with one or
more optical fibers (F) attached thereon, said fibers (F) comprising a fiber core,
an inner cladding surrounding said core and a primary coating surrounding said inner
cladding, characterized in that said optical fibers (F) being glued with their primary coating into a ferrule (E)
of a connector.
8. A method of producing a connector for one ore more optical fibers (F) comprising a
fiber core, an inner cladding surrounding said core and a primary coating surrounding
said inner cladding, characterized by the step of gluing said fibers (F) with their primary coating directly into a ferrule
(E).
9. A method of manufacturing optical fibers (F) comprising the steps of drawing the fiber
under predefined processing temperature from a blank and coating the fiber with a
primary coating, characterized that the drawing speed is controlled such that the
outer diameter of the primary coating has a predefined tolerance of preferably less
than ±2 microns.
Amended claims in accordance with Rule 86(2) EPC.
1. A connector for one or more optical fibers (F) comprising a fiber core, an inner
cladding surrounding said core and a primary coating surrounding said inner cladding,
said connector comprising a ferrule (E) into which said one or more optical fibers
(F) are glued, characterized in that said one or more fibers (F) are glued with their unstripped, straight fiber end into
said ferrule (E).
2. A connector according to claim 1, wherein said primary coating of the fibers (F)
has a tolerance of ±2 microns or less, preferably of ±1 microns, in diameter.
3. A connector according to claim 1. wherein said optical fibers (F) are glued into
said ferrule (E) using an UV-curable resin (G).
4. A connector according to claim 1, wherein said optical fibers (F) are arranged
to a ribbon fiber.
5. A circuit board comprising one or more electrical high-speed components (ASIC 1-5)
connected by means of optical fibers (F) comprising a fiber core, an inner cladding
surrounding said core and a primary coating surrounding said inner cladding, characterized in that said optical fibers (F) being glued with their unstripped, straight fiber end into
a ferrule (E) and said ferule being connected to a corresponding counterpart on the
circuit board.
6. A circuit board according to claim 5, wherein said optical fibers are attached
on a flexible foil building an overlay (OL) on top of the circuit board.
7. An optical overlay (OL) for a circuit board, comprising a flexible foil with one
or more optical fibers (F) attached thereon, said fibers (F) comprising a fiber core,
an inner cladding surrounding said core and a primary coating surrounding said inner
cladding, characterized in that said optical fibers (F) being glued with their unstripped, straight fiber end into
a ferrule (E) of a connector.
8. A method of manufacturing a connector for one ore more optical fibers (F) comprising
a fiber core, an inner cladding surrounding said core and a primary coating surrounding
said inner cladding, characterized by the step of gluing said fibers (F) with their unstripped, straight fiber end directly
into a ferrule (E).
9. A method of manufacturing optical fibers (F) for use on printed circuit boards,
said method comprising the steps of drawing the fiber under predefined processing
temperature from a blank and coating the fiber with a primary coating, characterized in that the drawing speed is controlled such that the outer diameter of the primary coating
has a predefined tolerance of preferably less than ±2 microns.