(19)
(11) EP 1 294 534 A1

(12)

(43) Date of publication:
26.03.2003 Bulletin 2003/13

(21) Application number: 01937595.5

(22) Date of filing: 18.05.2001
(51) International Patent Classification (IPC)7: B24B 37/04, B24B 49/02, B24B 49/12
(86) International application number:
PCT/US0116/290
(87) International publication number:
WO 0108/9765 (29.11.2001 Gazette 2001/48)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR

(30) Priority: 19.05.2000 US 574008
10.07.2000 US 217228 P
27.07.2000 US 221668 P

(71) Applicant: Applied Materials, Inc.
Santa Clara,California 95054 (US)

(72) Inventors:
  • HANAWA, Hiroji
    Sunnyvale, CA 94086 (US)
  • JOHANSSON, Nils
    Los Gatos, CA 95032 (US)
  • SWEDEK, Boguslaw, A.
    San Jose, CA 95131 (US)
  • BIRANG, Manoocher
    Los Gatos, CA 95033 (US)
  • REDEKER, Fritz, C.
    Fremont, CA 94539 (US)
  • BAJAJ, Rajeev
    Santa Clara, CA 95054 (US)

(74) Representative: Bayliss, Geoffrey Cyril et al
BOULT WADE TENNANT,Verulam Gardens70 Gray's Inn Road
London WC1X 8BT
London WC1X 8BT (GB)

   


(54) IN-SITU ENDPOINT DETECTION AND PROCESS MONITORING METHOD AND APPARATUS FOR CHEMICAL MECHANICAL POLISHING