(19)
(11) EP 1 295 321 A1

(12)

(43) Date of publication:
26.03.2003 Bulletin 2003/13

(21) Application number: 01906705.7

(22) Date of filing: 26.01.2001
(51) International Patent Classification (IPC)7: H01L 21/3105
(86) International application number:
PCT/US0102/616
(87) International publication number:
WO 0105/6070 (02.08.2001 Gazette 2001/31)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 27.01.2000 US 491645

(71) Applicants:
  • Infineon Technologies North America Corp.
    San Jose, CA 95112-4508 (US)
  • International Business Machines Corporation
    Armonk, NY 10504 (US)

(72) Inventors:
  • HANSON, David, R.
    Brewster, NY 10509 (US)
  • MUELLER, Gerhard
    86405 Meitingen (DE)

(74) Representative: Epping Hermann & Fischer 
Ridlerstrasse 55
80339 München
80339 München (DE)

   


(54) PLANARIZATION PROCESS TO ACHIEVE IMPROVED UNIFORMITY ACROSS SEMICONDUCTOR WAFERS