(19)
(11) EP 1 309 424 A2

(12)

(88) Date of publication A3:
23.05.2002

(43) Date of publication:
14.05.2003 Bulletin 2003/20

(21) Application number: 01962017.8

(22) Date of filing: 09.08.2001
(51) International Patent Classification (IPC)7B24D 11/00, B24B 37/04
(86) International application number:
PCT/US0125/006
(87) International publication number:
WO 0201/4018 (21.02.2002 Gazette 2002/08)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 14.08.2000 JP 2000245793

(71) Applicant: 3M Innovative Properties Company
Saint Paul, MN 55133-3427 (US)

(72) Inventors:
  • AMANO, Takashi
    Kanagawa 240-0052 (JP)
  • WATASE, Toshihiko
    Tokyo 206-0803 (JP)
  • IMAMURA, Kengo
    Ebina City,Kanagawa 243-0432 (JP)

(74) Representative: von Kreisler, Alek, Dipl.-Chem. 
Patentanwälte,von Kreisler-Selting-Werner,Bahnhofsvorplatz 1 (Deichmannhaus)
50667 Köln
50667 Köln (DE)

   


(54) ABRASIVE PAD FOR CMP