(19)
(11) EP 1 315 187 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
16.03.2005 Bulletin 2005/11

(43) Date of publication A2:
28.05.2003 Bulletin 2003/22

(21) Application number: 02025945.3

(22) Date of filing: 20.11.2002
(51) International Patent Classification (IPC)7H01H 11/00
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SK TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 21.11.2001 JP 2001355550

(71) Applicant: Kabushiki Kaisha Tokai Rika Denki Seisakusho
Niwa-gun, Aichi 480-0195 (JP)

(72) Inventors:
  • Ogimoto, Takao
    Ohguchi-cho, Niwa-gun, Aichi 480-0195 (JP)
  • Miyake, Fusatomo
    Ohguchi-cho, Niwa-gun, Aichi 480-0195 (JP)
  • Sakai, Noriyasu
    Ohguchi-cho, Niwa-gun, Aichi 480-0195 (JP)
  • Oshima, Takahiro
    Ohguchi-cho, Niwa-gun, Aichi 480-0195 (JP)

(74) Representative: Rupp, Christian, Dipl.Phys. et al
Mitscherlich & Partner Patent- und Rechtsanwälte Sonnenstrasse 33
80331 München
80331 München (DE)

   


(54) Substrate and manufacturing method thereof


(57) The slide switch (15) includes five fixed contact points (28a to 28e) and five movable contact points (32a). The movable contact points (32a) slide along the fixed contact points (28a to 28e) to switch the connection state with the fixed contact points (28a to 28e). A substrate (25) for the slide switch (15) has the fixed contact points (28a to 28e) and terminals (23a to 23e), each of which is electrically connected to one of the fixed contact points (28a to 28e). Each fixed contact point (28a to 28e) and the corresponding terminal (23a to 23e) are integrally formed. According to the substrate (25), a process to connect each fixed contact point (28a to 28e) to the corresponding terminal (23a to 23e) is omitted. Therefore, the number of manufacturing processes for the substrate (25) is reduced.







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