(19)
(11) EP 1 315 780 A2

(12)

(88) Date of publication A3:
06.06.2002

(43) Date of publication:
04.06.2003 Bulletin 2003/23

(21) Application number: 01968695.5

(22) Date of filing: 07.09.2001
(51) International Patent Classification (IPC)7: C09J 7/02, C09J 5/06, H01R 4/04
(86) International application number:
PCT/US0128/141
(87) International publication number:
WO 0202/0686 (14.03.2002 Gazette 2002/11)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 08.09.2000 JP 2000273119

(71) Applicant: 3M Innovative Properties Company
Saint Paul, MN 55133-3427 (US)

(72) Inventors:
  • KAWATE, Kohichiro
    Machida-city,Tokyo 194-0041 (JP)
  • HIRASAWA, Yuji
    Sagamihara City,Kanagawa 229-0037 (JP)

(74) Representative: VOSSIUS & PARTNER 
Siebertstrasse 4
81675 München
81675 München (DE)

   


(54) THERMOCURABLE ELECTROCONDUCTIVE ADHESIVE SHEET, CONNECTION STRUCTURE AND CONNECTION METHOD USING THE SAME