(19)
(11) EP 1 316 107 A2

(12)

(88) Date of publication A3:
25.07.2002

(43) Date of publication:
04.06.2003 Bulletin 2003/23

(21) Application number: 01984577.5

(22) Date of filing: 18.07.2001
(51) International Patent Classification (IPC)7H01L 21/316
(86) International application number:
PCT/US0122/855
(87) International publication number:
WO 0201/9411 (07.03.2002 Gazette 2002/10)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 29.08.2000 US 650961

(71) Applicant: ATMEL CORPORATION
San Jose,California 95131 (US)

(72) Inventors:
  • KELKAR, Amit, S.
    Irving, Texas 75063 (US)
  • WHITEMAN, Michael, D.
    Woodland Park, CO 80866 (US)

(74) Representative: Käck, Jürgen 
Kahler Käck MollekopfVorderer Anger 239
86899 Landsberg/Lech
86899 Landsberg/Lech (DE)

   


(54) METHOD OF FORMING A PRE-METAL DIELECTRIC FILM ON A SEMICONDUCTOR SUBSTRATE