(19)
(11) EP 1 320 804 A2

(12)

(88) Date of publication A3:
22.08.2002

(43) Date of publication:
25.06.2003 Bulletin 2003/26

(21) Application number: 01968854.8

(22) Date of filing: 14.09.2001
(51) International Patent Classification (IPC)7: G06F 13/16
(86) International application number:
PCT/US0128/627
(87) International publication number:
WO 0202/5454 (28.03.2002 Gazette 2002/12)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 14.09.2000 US 232596 P
18.09.2000 US 666528

(71) Applicant: Intel Corporation
Santa Clara, CA 95202 (US)

(72) Inventors:
  • HALBERT, John
    Beaverton, OR 97007 (US)
  • BONELLA, Randy, M.
    Portland, OR 97219 (US)

(74) Representative: Nicholls, Michael John 
J.A. KEMP & CO.,14, South Square,Gray's Inn
London WC1R 5JJ
London WC1R 5JJ (GB)

   


(54) MEMORY MODULE HAVING BUFFER FOR ISOLATING STACKED MEMORY DEVICES