(19)
(11) EP 1 320 880 A2

(12)

(88) Date of publication A3:
11.07.2002

(43) Date of publication:
25.06.2003 Bulletin 2003/26

(21) Application number: 01985776.2

(22) Date of filing: 19.09.2001
(51) International Patent Classification (IPC)7: H01L 21/48
(86) International application number:
PCT/US0129/195
(87) International publication number:
WO 0202/7779 (04.04.2002 Gazette 2002/14)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE

(30) Priority: 26.09.2000 US 669584

(71) Applicant: Infineon Technologies Richmond, LP
Sandstone, VA 23150 (US)

(72) Inventors:
  • KOCH, Ronald
    Richmond, VA 23229 (US)
  • BLUMENAUER, Michael
    Glen Allen, VA 23060 (US)
  • POOLE, David
    Mechanicsville, VA 23111 (US)
  • HETZEL, Wolfgang
    89564 Nattheim (DE)

(74) Representative: Epping Hermann & Fischer 
Ridlerstrasse 55
80339 München
80339 München (DE)

   


(54) SINGULATION OF SEMICONDUCTOR PACKAGES BY TIE BAR CUTTING