(19)
(11) EP 1 321 215 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
08.08.2012 Bulletin 2012/32

(45) Mention of the grant of the patent:
04.07.2012 Bulletin 2012/27

(21) Application number: 02258728.1

(22) Date of filing: 18.12.2002
(51) International Patent Classification (IPC): 
B23K 1/08(2006.01)

(54)

Method and apparatus for local application of solder to preselected conductor areas on a printed circuit board

Verfahren und Vorrichtung zum Auftragen von Lötmaterial auf ausgewählten Leiterstellen einer Leiterplatte

Méthode et dispositif pour l'application de brasure sur des conducteurs prédéterminés d'un circuit imprimé

(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR IE IT LI LU MC NL PT SE SI SK TR

(30) Priority: 18.12.2001 JP 2001384362

(43) Date of publication of application:
25.06.2003 Bulletin 2003/26

(73) Proprietor: SENJU METAL INDUSTRY CO., LTD.
Tokyo (JP)

(72) Inventors:
  • Takaguchi, Akira, c/o KTT Co. Ltd.
    Nei-gun, Toyama-ken (JP)
  • Wata, Masaki, c/o Senju Metal Industry Co. Ltd.
    Tokyo (JP)
  • Numata, Chikara, c/o Senju Metal Industry Co. Ltd.
    Tokyo (JP)

(74) Representative: Makovski, Priscilla Mary 
Barker Brettell LLP 100 Hagley Road
Edgbaston Birmingham B16 8QQ
Edgbaston Birmingham B16 8QQ (GB)


(56) References cited: : 
WO-A-99/41036
US-A- 3 732 615
 US-A- 3 565 319
   
       
    Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).