(19)
(11) EP 1 326 300 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
21.02.2007 Bulletin 2007/08

(45) Mention of the grant of the patent:
12.07.2006 Bulletin 2006/28

(21) Application number: 02023038.9

(22) Date of filing: 16.10.2002
(51) International Patent Classification (IPC): 
H01P 1/203(2006.01)
H01P 11/00(2006.01)
 H01P 7/10(2006.01)

(54)

Mounting structure of high-frequency semiconductor apparatus and its production method

Befestigungsanordnung für Hochfrequenz-Halbleitervorrichtung und zugehöriges Herstellungsverfahren

Structure de fixation pour appareil semi-conducteur haute fréquence et son procédé de fabrication

(84) Designated Contracting States:
DE FR GB IT

(30) Priority: 08.01.2002 JP 2002001296

(43) Date of publication of application:
09.07.2003 Bulletin 2003/28

(73) Proprietor: Hitachi, Ltd.
Tokyo 100-8280 (JP)

(72) Inventor:
  • Sasada, Yoshiyuki
    Hitachinaka-shi, Ibaraki 312-0052 (JP)

(74) Representative: Beetz & Partner 
Steinsdorfstrasse 10
80538 München
80538 München (DE)


(56) References cited: : 
EP-A- 0 915 528
US-A- 4 307 352
 EP-A- 0 996 188
   
  • PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09, 31 July 1998 (1998-07-31) & JP 10 093219 A (TOSHIBA CORP), 10 April 1998 (1998-04-10)
   
Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).