(19)
(11) EP 1 327 264 A1

(12)

(43) Date of publication:
16.07.2003 Bulletin 2003/29

(21) Application number: 01906665.3

(22) Date of filing: 25.01.2001
(51) International Patent Classification (IPC)7H01L 23/485, H01L 21/56
(86) International application number:
PCT/US0102/385
(87) International publication number:
WO 0203/3750 (25.04.2002 Gazette 2002/17)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 17.10.2000 US 690600

(71) Applicant: 3M Innovative Properties Company
Saint Paul, MN 55133-3427 (US)

(72) Inventors:
  • HOGERTON, Peter, B.
    Saint Paul, MN 55133-3427 (US)
  • CHEN, Kevin, Y.
    Saint Paul, MN 55133-3427 (US)
  • GERBER, Joel, A.
    Saint Paul, MN 55133-3427 (US)
  • ZENNER, Robert, L., D.
    Saint Paul, MN 55133-3427 (US)

(74) Representative: Hilleringmann, Jochen et al
Bahnhofsvorplatz 1,Deichmannhaus
50667 Köln
50667 Köln (DE)

   


(54) SOLVENT ASSISTED BURNISHING OF PRE-UNDERFILLED SOLDER-BUMPED WAFERS FOR FLIPCHIP BONDING