USE OF METALLIC TREATMENT ON COPPER FOIL TO PRODUCE FINE LINES AND REPLACE OXIDE PROCESS IN PRINTED CIRCUIT BOARD PRODUCTION - Patent 1332653

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EP 1 332 653 A1

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(43)	Date of publication:
	06.08.2003 Bulletin 2003/32

(21)	Application number: 01979868.5

(22)	Date of filing: 17.10.2001

(51)	International Patent Classification (IPC)⁷: H05K 3/06, H05K 3/24, H05K 3/38

(86)	International application number:
	PCT/US0132/400

(87)	International publication number:
	WO 0203/5897 (02.05.2002 Gazette 2002/18)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

26.10.2000 US 697614

(71)	Applicant: Oak-Mitsui, Inc.
	Hoosick Falls,New York 12090 (US)

(72)	Inventor:
	ANDRESAKIS, John, A. Clifton Parks, NY 12065 (US)

(74)	Representative: Zounek, Nikolai, Dipl.-Ing.
	Patentanwaltskanzlei Zounek,Industriepark Kalle-Albert,Gebäude H 391,Rheingaustrasse 190-196 65174 Wiesbaden 65174 Wiesbaden (DE)

(54)	USE OF METALLIC TREATMENT ON COPPER FOIL TO PRODUCE FINE LINES AND REPLACE OXIDE PROCESS IN PRINTED CIRCUIT BOARD PRODUCTION