(19)
(11) EP 1 338 028 A1

(12)

(43) Date of publication:
27.08.2003 Bulletin 2003/35

(21) Application number: 00982323.8

(22) Date of filing: 01.12.2000
(51) International Patent Classification (IPC)7H01L 21/00
(86) International application number:
PCT/US0032/655
(87) International publication number:
WO 0301/2830 (13.02.2003 Gazette 2003/07)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(71) Applicants:
  • Wafermasters, Incorporated
    San Jose, CA 95112 (US)
  • TOKYO ELECTRON LIMITED
    Minato-ku,Tokyo 107-8481 (JP)

(72) Inventors:
  • KURIBAYASHI, Hiromitsu
    Sagamihara City, Kanagawa 229-0016 (JP)
  • YOO, Woo, Sik
    Palo Alto, CA 94303 (US)

(74) Representative: Freeman, Jacqueline Carol 
W.P. THOMPSON & CO.55 Drury Lane
London WC2B 5SQ
London WC2B 5SQ (GB)

   


(54) WAFER PROCESSING SYSTEM INCLUDING A ROBOT