| (19) |
 |
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(11) |
EP 1 348 728 A8 |
| (12) |
CORRECTED EUROPEAN PATENT APPLICATION |
| (48) |
Corrigendum issued on: |
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17.12.2003 Bulletin 2003/51 |
| (43) |
Date of publication: |
|
01.10.2003 Bulletin 2003/40 |
| (22) |
Date of filing: 30.01.2003 |
|
| (51) |
International Patent Classification (IPC)7: C08G 73/10 |
|
| (84) |
Designated Contracting States: |
|
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT SE SI SK TR |
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Designated Extension States: |
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AL LT LV MK RO |
| (30) |
Priority: |
27.03.2002 JP 2002088089
|
| (71) |
Applicant: Nippon Mektron, Limited |
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Minato-ku Tokyo (JP) |
|
| (72) |
Inventors: |
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- Zou, Min
Kitaibaraki city, Ibaraki (JP)
- Lin, Jenq-Tain
Kitaibaraki city, Ibaraki (JP)
|
| (74) |
Representative: HOFFMANN - EITLE |
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Patent- und Rechtsanwälte Arabellastrasse 4
81925 München
81925 München (DE) |
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| |
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| (54) |
Film-formable polyimide copolymer |
(57) A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic
acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3 ' ,4,4
' -benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole
has a heat-resistant dimensional stability without any deterioration of mechanical
properties inherent in the polyimide resin when used as a film.