METHOD AND APPARATUS FOR CONTROLLING THICKNESS UNIFORMITY OF ELECTROPLATED LAYER - Patent 1360348

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EP 1 360 348 A1

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(43)	Date of publication:
	12.11.2003 Bulletin 2003/46

(21)	Application number: 01998036.6

(22)	Date of filing: 11.12.2001

(51)	International Patent Classification (IPC)⁷: C25D 17/00, C25D 5/02, C25D 7/12, C25D 21/12, C25D 5/00, C25D 5/06, C25C 3/16

(86)	International application number:
	PCT/US0147/445

(87)	International publication number:
	WO 0206/3072 (15.08.2002 Gazette 2002/33)

(84)	Designated Contracting States:
	AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
	Designated Extension States:
	AL LT LV MK RO SI

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Priority:

21.12.2000 US 256924 P
15.05.2001 US 855059

(71)	Applicant: Nu Tool Inc.
	Milpitas, CA 95035 (US)

(72)	Inventors:
	BASOL, Bulent, M. Manhattan Beach, CA 90266 (US) LINDQUIST, Paul Eagle, ID 83616 (US)

(74)	Representative: Laufhütte, Dieter, Dr.-Ing. et al
	Lorenz-Seidler-GosselWidenmayerstrasse 23 80538 München 80538 München (DE)

(54)	METHOD AND APPARATUS FOR CONTROLLING THICKNESS UNIFORMITY OF ELECTROPLATED LAYER