(19)
(11) EP 1 362 670 B8

(12) CORRECTED EUROPEAN PATENT SPECIFICATION
Note: Bibliography reflects the latest situation

(15) Correction information:
Corrected version no 1 (W1 B1)

(48) Corrigendum issued on:
04.11.2009 Bulletin 2009/45

(45) Mention of the grant of the patent:
16.07.2008 Bulletin 2008/29

(21) Application number: 03011243.7

(22) Date of filing: 16.05.2003
(51) International Patent Classification (IPC): 
B24B 37/04(2006.01)
C25F 3/30(2006.01)
 B23H 5/06(2006.01)
H01L 21/306(2006.01)

(54)

Method and apparatus for chemical mechanical polishing

Verfahren und Vorrichtung zum chemisch-mechanischen Polieren

Procédé et dispositif de polissage mécano-chimique

(84) Designated Contracting States:
DE FR IT

(30) Priority: 17.05.2002 JP 2002142632

(43) Date of publication of application:
19.11.2003 Bulletin 2003/47

(73) Proprietors:
  • TOKYO SEIMITSU CO., LTD.
    Mitaka-shi Tokyo (JP)
  • Doi, Toshiro
    Fukuoka-shi, Fukuoka 814-0001 (JP)

(72) Inventors:
  • Doi, Toshiro
    Fukuoka-shi Fukuoka 814-0001 (JP)
  • Fujita, Takashi
    Mitaka-shi Tokyo (JP)

(74) Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät 
Leopoldstrasse 4
80802 München
80802 München (DE)


(56) References cited: : 
WO-A-02/17411
 US-B1- 6 368 190
   
  • PATENT ABSTRACTS OF JAPAN vol. 0113, no. 60 (M-645), 25 November 1987 (1987-11-25) & JP 62 136317 A (INOUE JAPAX RES INC), 19 June 1987 (1987-06-19)
   
Note: Within nine months from the publication of the mention of the grant of the European patent, any person may give notice to the European Patent Office of opposition to the European patent granted. Notice of opposition shall be filed in a written reasoned statement. It shall not be deemed to have been filed until the opposition fee has been paid. (Art. 99(1) European Patent Convention).