(19)
(11) EP 1 365 880 A1

(12)

(43) Date of publication:
03.12.2003 Bulletin 2003/49

(21) Application number: 02707453.3

(22) Date of filing: 10.01.2002
(51) International Patent Classification (IPC)7B23K 26/38, B29C 67/00
(86) International application number:
PCT/US0200/867
(87) International publication number:
WO 0206/0636 (08.08.2002 Gazette 2002/32)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 31.01.2001 US 265556 P
09.03.2001 US 803382

(71) Applicant: ELECTRO SCIENTIFIC INDUSTRIES, INC.
Portland, OR 97229-5497 (US)

(72) Inventors:
  • BAIRD, Brian, W.
    Oregon City, OR 97045 (US)
  • WOLFE, Michael, J.
    Portland, OR 97225 (US)
  • HARRIS, Richard, J.
    Portland, OR 97229 (US)
  • FAHEY, Kevin, P.
    Portland, OR 97225 (US)
  • ZOU, Lian-Cheng
    Portland, OR 97221 (US)
  • MCNEIL, Thomas, R.
    Beaverton, OR 97006 (US)

(74) Representative: Meddle, Alan Leonard et al
Forrester & BoehmertPettenkoferstrasse 20-22
80336 München
80336 München (DE)

   


(54) ULTRAVIOLET LASER ABLATIVE PATTERNING OF MICROSTRUCTURES IN SEMICONDUCTORS