(19)
(11) EP 1 373 588 A1

(12)

(43) Date of publication:
02.01.2004 Bulletin 2004/01

(21) Application number: 02703649.0

(22) Date of filing: 08.03.2002
(51) International Patent Classification (IPC)7: C22C 9/00, H01B 1/02
(86) International application number:
PCT/FI2002/000184
(87) International publication number:
WO 2002/072901 (19.09.2002 Gazette 2002/38)
(84) Designated Contracting States:
AT BE CH CY DE DK ES FI FR GB GR IE IT LI LU MC NL PT SE TR
Designated Extension States:
AL LT LV MK RO SI

(30) Priority: 09.03.2001 FI 20010473

(71) Applicant: Outokumpu Oyj
02200 Espoo (FI)

(72) Inventors:
  • SALONEN, Timo
    FIN-33500 Tampere (FI)
  • KILPINEN, Antti
    SF-20520 Turku (FI)

(74) Representative: Zipse + Habersack 
Wotanstrasse 64
80639 München
80639 München (DE)

   


(54) MICRO-ALLOYED OXYGEN-FREE COPPER ALLOY AND ITS USE