(19)
(11) EP 1 374 302 A2

(12)

(88) Date of publication A3:
23.10.2003

(43) Date of publication:
02.01.2004 Bulletin 2004/01

(21) Application number: 01953389.2

(22) Date of filing: 27.06.2001
(51) International Patent Classification (IPC)7: H01L 23/00
(86) International application number:
PCT/US2001/020354
(87) International publication number:
WO 2002/001632 (03.01.2002 Gazette 2002/01)
(84) Designated Contracting States:
DE FR IT

(30) Priority: 27.06.2000 US 604534

(71) Applicants:
  • Infineon Technologies AG
    81669 München (DE)
  • International Business Machines Corporation
    Armonk, N.Y. 10504 (US)

(72) Inventors:
  • MATUSIEWICZ, Gerald
    Poughkeepsie, NY 12603 (US)
  • BRASE, Gabriela
    F-91603 Narolles-eu-h (FR)

(74) Representative: Epping Hermann & Fischer 
Ridlerstrasse 55
80339 München
80339 München (DE)

   


(54) INTERCONNECTION FOR ACCOMODATING THERMAL EXPANSION FOR LOW ELASTIC MODULUS DIELECTRICS