(19)
(11) EP 1 383 362 A3

(12) EUROPEAN PATENT APPLICATION

(88) Date of publication A3:
04.01.2006 Bulletin 2006/01

(43) Date of publication A2:
21.01.2004 Bulletin 2004/04

(21) Application number: 03016244.0

(22) Date of filing: 17.07.2003
(51) International Patent Classification (IPC): 
H05K 1/09(2006.01)
H05K 3/40(2006.01)
 H05K 3/46(2006.01)
H01B 1/16(2006.01)
(84) Designated Contracting States:
AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HU IE IT LI LU MC NL PT RO SE SI SK TR
Designated Extension States:
AL LT LV MK

(30) Priority: 17.07.2002 JP 2002208322
17.07.2002 JP 2002208323

(71) Applicant: NGK SPARK PLUG CO., LTD
Mizuho-ku Nagoya-shi Aichi (JP)

(72) Inventors:
  • Sumi, Hiroshi
    Mizuho-ku, Nagoya-shi, Aichi (JP)
  • Mitzutani, Hidetoshi
    Mizuho-ku, Nagoya-shi, Aichi (JP)
  • Sato, Manabu
    Mizuho-ku, Nagoya-shi, Aichi (JP)

(74) Representative: Grünecker, Kinkeldey, Stockmair & Schwanhäusser Anwaltssozietät 
Maximilianstrasse 58
80538 München
80538 München (DE)

   


(54) Copper paste and wiring board using the same


(57) A wiring board obtained by filling a copper paste in a via hole formed on a ceramic green sheet and firing it to form an insulating layer and a via conductor (3), the copper paste comprising a copper powder (5), an organic vehicle and at least one (7) selected from the group consisting of: a ceramic particle having an average particle size of 100 nm or less; and an Fe2O3 particle, wherein the copper paste comprises from 6 to 20 parts by mass of the organic vehicle per 100 parts by mass of the copper powder.







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