(19)
(11) EP 1 385 363 A8

(12) CORRECTED EUROPEAN PATENT APPLICATION
published in accordance with Art. 158(3) EPC

(48) Corrigendum issued on:
22.09.2004 Bulletin 2004/39

(43) Date of publication:
28.01.2004 Bulletin 2004/05

(21) Application number: 02713291.9

(22) Date of filing: 04.04.2002
(51) International Patent Classification (IPC)7: H05K 1/11, H05K 3/40, H05K 3/46
(86) International application number:
PCT/JP2002/003379
(87) International publication number:
WO 2002/085081 (24.10.2002 Gazette 2002/43)
(84) Designated Contracting States:
DE FR

(30) Priority: 06.04.2001 JP 2001108381

(71) Applicants:
  • Mitsui Mining & Smelting Co., Ltd.
    Tokyo 141-8584 (JP)
  • Suzuki Co., Ltd
    Suzaka-shi, Nagano 382-8588 (JP)

(72) Inventors:
  • HAYASHI, Katsuhiko,MITSUI MINING & SMELTING CO LTD
    Ageo-shi, Saitama 362-0021 (JP)
  • KATAOKA, Tatsuo, MITSUI MINING & SMELTING CO LTD
    Ageo-shi, Saitama 362-00 (JP)
  • KAWAMURA, Hirokazu,MITSUI MINING & SMELTING CO LTD
    Ageo-shi, Saitama 362-0021 (JP)
  • ICHIRYU, Akira, MITSUI MINING & SMELTING CO LTD
    Ageo-shi, Saitama 362-0021 (JP)

(74) Representative: Whalley, Kevin 
MARKS & CLERK, 57-60 Lincoln's Inn Fields
London WC2A 3LS
London WC2A 3LS (GB)

   


(54) PRINTED CIRCUIT BOARD AND PRODUCTION METHOD THEREFOR, AND LAMINATED PRINTED CIRCUIT BOARD


(57) A print circuit board including a dielectric substrate (12) having via-holes (16) perforated therethrough, an implant material (15) filled in the via-holes (16) and selected from a group consisting of oxygen free copper, phosphorus-deoxidized copper and tough pitch copper, and interconnect patterns formed on both surfaces of the substrate (12) and electrically connected to the implant material (15). The probability of generating the deficiencies in the print circuit board of the present invention is reduced under the conditions of the repeated heating and cooling between higher temperatures and lower temperatures to which the print circuit board is likely exposed because the via-holes (16) are made of the highly resistant oxygen free copper, phosphorus-deoxidized copper or tough pitch copper, and the print circuit board is used for a longer period of time as a highly heat-resistant print circuit board.