Flexible surface layer film for delivery of highly filled or low cross-linked thermally conductive interface pads

Description

[0001] The present invention relates generally to an improved composite material for use as an interface or in forming a mounting pad to be interposed along a heat dissipating path between a solid state electronic device and a heat sinking surface. The composite consists of a multi-layer pad comprising a bulk layer flanked by skin layers which may be different in chemical composition and/or physical properties integrally bonded to and mated with the bulk layer so as to form a composite having good mechanical properties along with excellent thermal properties. The composites of the present invention are useful in the production and manufacturing of electronic systems inasmuch as the skin layers are well adapted to receive and reasonably hold a release liner, which is readily removable from the composite during or following production and handling operations.

[0002] In order to enhance the thermal properties of interface mounting pads, it is generally the practice to increase the particulate loading of the resin system of a composite. Increased loading, while improving the thermal properties, generally has an adverse effect upon the mechanical properties. To decrease hardness of highly filled composites, it is customary to reduce cross-linking of the resin system or use gel-like resins. In this connection, excessive loading and light cross-linking typically leads to a reduction in the cohesive strength of the blend, so that the product becomes difficult and/or impossible to handle in production operations. By way of example, the effective use of a release film is impeded because of the tendency for portions of the mounting pad to adhere to the release film upon removal. Also, the pad can tear while it is being pulled off a liner due to its low cohesive strength. Loss of portions of the pad renders the structure unusable for its intended purpose due to the creation of air entraining voids. Surface disruptions of any sort are, of course, unacceptable for interface mounting pads.

[0003] US Patent 4,869,954 describes a multi-layer thermally conductive material comprising a central bulk layer comprising either metal foil, polymeric film, metal mesh or glass fibre to which are bonded surface skin layers comprised of a urethane matrix and containing thermally conductive particulate filler. While variation in the degree of loading of the thermally conductive particulate filler in the skin layers is described, there is no mention of differing degrees of particulate loading from one surface skin to the other.

[0004] The present invention aims to produce a pad that is soft, highly filled and can be easily processed in a production operation.

[0005] The bulk layer may comprise a silicone elastomer containing thermally conductive fillers such as, for example, alumina, boron nitride, aluminum nitride, graphite, zinc oxide, aluminum, copper powder, silver powder and other thermally conductive ceramics or metals including blends or mixtures thereof. As indicated above, however, the bulk layer employs a high concentration of such fillers. Alternative resins for the bulk and surface layers that may be useful are polyethylene, epoxy, acrylic, polyurethane, polyester, or polybutadiene. The bulk layer has a thermal conductivity in the range of 1-15 W/m.K. with a hardness ranging from between about 10-80 Shore 00. The thickness of the bulk layer will typically range from between about 254 µm and 6,35 mm (10 and 250 mils).

[0006] The surface or skin layers are likewise filled with similar conductive fillers. The skin layer may employ the same resin system as the bulk layer, with distinctively different mechanical properties. Other resin systems including epoxy, acrylic, polyurethane, polyester or elastomeric rubbers compatible with that of the bulk may also be employed. The skin layer typically has a thermal conductivity ranging from between about 0.3-5 W/m.K. with a significantly higher hardness than that of the bulk, such as in the range of between about 30 Shore 00 to 60 Shore Å. The properties of the skin layer permit it to be applied as a hot-melt of flexible film, thereby not adversely affecting the overall thermal performance of the bulk or center layer. Furthermore, it neither alters nor increases the hardness of the bulk material inasmuch as the skin layer is typically between about 2 and 50 microns in thickness.

[0007] According to the present invention there is provided a flexible plastic thermally conductive multi-layer semiconductor mounting pad comprising a highly thermally conductive central bulk layer having a hardness of 10-80 Shore 00, and thermally conductive surface skin layers bonded integrally to at least one of a pair of opposed major surfaces of the central bulk layer;
said central bulk layer comprising a flexible polymeric resin matrix selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester and polybutadiene; said central bulk layer being filled with a finely divided thermally conductive particulate which is present in said polymeric matrix in an amount ranging from between about 10% and 85% by volume;
characterised in that said surface skin layers have a thickness of between 2 and 50 microns and are selected from a polymeric resin which is compatible with the polymeric matrix of said central bulk layer and selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester and polybutadiene, and in that said surface skin layers are blended with a thermally conductive finely divided particulate filler in an amount that is less than that present in said central bulk layer, and ranging from between about 5% and 60% by volume, the hardness of said surface skin layer being substantially greater than that of the bulk layer, and ranging from between about 20 Shore 00 and 60 Shore A.

SUMMARY OF THE INVENTION

[0008] The thermal interface pads of the present invention are particularly useful in those applications requiring a pad of low hardness. The composite of the present invention has other desirable physical properties due to the formation of skin layers with good strength and flexibility. These features render the entire composite dimensionally stable, in spite of the utilization of a bulk or center layer of low cohesive strength and otherwise poor mechanical strength. Furthermore, the properties of the skin layer are such that it eliminates the problem of the bulk layer having a tendency to stick, adhere to, or otherwise block liner surfaces including such typical liner materials as standard silicone release liners and Teflon®, thus rendering materials of the present invention readily removable from the liner after processing or following a particular end use operation or step. Furthermore, the presence of the high strength skin layer makes it possible to easily remove the entire composite from standard silicone release liners. The properties of the skin layer also gives the entire composite sufficient dimensional stability to withstand typical pick-and-place production applications.

[0009] The properties of the skin layer permit and make possible the manufacturing and utilization of highly filled and/or low cross-linked materials. In this connection, therefore, the interface pads prepared in accordance with the present invention will flow and otherwise conform to any micro-void or deformity in the surface against which it is placed in the mounting operation. Therefore, interface devices prepared in accordance with the present invention will utilize a skin layer having a greater modulus than the bulk, as well as greater flexibility. This property significantly reduces interfacial thermal resistance and accordingly enhances thermal performance of the entire composite for thermal management purposes.

[0010] Therefore, it is a primary object of the present invention to provide an improved interface mounting pad to be interposed between opposed surfaces of a solid state electronic device and a heat dissipating surface, with the pad consisting of a highly filled central bulk layer with low cohesive strength flanked by less highly filled bulk layers having good thermal properties along with excellent mechanical properties, so as to enhance the mechanical strength of the overall composite.

[0011] It is yet a further object of the present invention to provide an improved thermal interface pad for use in mounting semiconductor devices to surfaces of a heat sink, with the composite having excellent thermal properties along with good mechanical properties including cohesive strength.

[0012] Other and further objects of the present invention will become apparent to those skilled in the art upon a study of the following specification, appended claims, and accompanying drawings.

[0013] Figure 1 is a perspective view, partially in section, and on an enlarged scale illustrating a typical interface mounting pad prepared in accordance with the present invention, with the individual layers being shown in section.

[0014] In accordance with the preferred embodiment of the present invention, and illustrated in the drawing, a flexible plastic thermally conductive multi-layer interface pad generally designated 10 is illustrated. Pad 10 comprises a center or bulk layer 11 flanked by a pair of thermally conductive surface skin layers 12 and 13 integrally bonded to opposed major surfaces of central bulk layer 11. Additionally, release liners 14 and 15 are disposed on the outer surfaces of skin layers 12 and 13, thereby providing a protective layer for the surfaces of the skin layers.

[0015] The bulk layer preferably comprises a blend of siloxane polymers, including vinyl and hydride terminated polymethylsiloxanes heavily filled with a finely divided thermally conductive particulate. For most applications, and assuming alumina as the particulate with a density of 3.75, the particulate present in the siloxane resin is in a range from between about 500 Phr to 2300 Phr. On a volumetric scale, the particulate is present in an amount ranging from between about 10 to 85% filler by volume, with a range of between 20% and 80% being preferred. In certain applications, the particulate may be selected as a blend of particulate made up of two separate size ranges. In one such application, the larger particulate has an average diameter of about 50 microns, which is blended with smaller particulate having an average diameter of approximately 2 microns. For most applications, a somewhat larger particulate is utilized in the bulk layer, generally greater than 2 microns. In those applications where it is utilized, the blend of particulate assists in enhancing the thermal properties of the bulk layer, with bi and tri models also being useful.

[0016] The skin layers have different physical and/or chemical properties than the bulk compatible with the bulk layer. Because of its higher cohesive strength, the skin improves the physical properties of the overall pad. The blend of materials for the surface skin layers includes thermally conductive particulate filler in a lesser quantity than in the bulk, preferably in a range of between about 5% and 60% by volume, with a range of between 10% and 40% being preferred.

[0017] In overall preparation, it has been found preferable to utilize a calendering operation to mate the skin layers with the bulk layer. Other laminating operations may be employed, if desired. For ease of material handling, it is, of course, preferable that a release liner be applied to the outer surfaces of the skin layers in order to expedite the laminating or mating operation.

[0018] In order to facilitate an explanation of the operation undertaken to prepare the multi-layer interface pads of the present invention, the following specific examples are provided.

(A) BULK LAYER

EXAMPLE I

[0019] 

Material	Parts by Weight, Grams
Silicone elastomer with modulus of 5-30 kPa (1-5 psi)	100
Alumina powder fillers	1200.

In actual preparation, the reactant mixture is prepared by thoroughly blending the resin components and fillers. Thereafter, the reaction inhibitor and catalyst are added. Thereafter, the reactant product is rolled or otherwise leveled to a pad having a thickness of the desired thickness, in this case, 254 µm-6,35 mm (10-250 mils). This pad is highly filled, having low degree of cross-linking and with a hardness of 30-60 Shore 00 and generally about 50 Shore 00. The mechanical properties render this pad difficult to release off Teflon® liners due primarily to its low cohesive strength. The addition of the skin layer facilitates the easy release of the composite from a liner, and facilitates handling. A silicone release liner with coated skin layer also helps in the production of a pad using silicone gel resins in the above example.

[0020] In modified versions of the formulation of Example I, the alumina powder filler may be increased to an amount up to 2000 parts by weight (grams) depending upon the thermal requirements and physical properties desired in the bulk layer.

EXAMPLE II

[0021] 

Material	Parts by Weight, Grams
Silicone elastomer with modulus of 5-30 kPa (1-5 psi)	100
Alumina powder filler	224.

in actual preparation, the reactant mixture is prepared by thoroughly blending the resin components and fillers. Thereafter, the reaction inhibitor and catalyst are added, after which the reactant product is leveled or rolled to a pad having a thickness of about 254 µm-6,35 mm (10-250 mils). This bulk material is lightly cross-linked and soft with a target hardness of 40 Shore 00. This product releases well from Teflon® but not from standard silicone release liners.

EXAMPLE III

[0022] 

Material	Parts by Weight, Grams
Silicone elastomer with modulus of 5-30 kPa (1-5 psi)	100
Alumina powder	242.
Alumina trihydrate powder	143.

In actual preparation, the reactant mixture is prepared by thoroughly blending the resin components and fillers. Thereafter, the reaction inhibitor and catalyst are added, after which the reactant product is rolled to a pad having a desired thickness of about 11,8 g/cm (10-250 mils). This is a low fill and elastic bulk material. Its adhesion property which is greater than 50 g/in. on the liner surface will result in stretching and severe deformation of the material. This makes it impossible to use after removal from the liners. The skin layers reduce the entire composite release off standard liners to less than 11,8 g/cm (30 g/in).

EXAMPLE IV

[0023] 

Material	Parts by Weight, Grams
Polybutadiene resin	100
Antioxidant	2
Catalyst	1.5
Alumina fillers	600.

This formula has a hardness of about 70 Shore 00. The material adheres or sticks to commercially available release liners and results in deformation of the pads at thicknesses of 254 µm-1,52 mm (10-60 mils). The skin layer facilitates easy release from standard silicone release liners at less than 11,8 g/cm (30 g/in) peel.

[0024] In certain formulations based upon this Example IV, the quantity of alumina filler may be reduced to 200 parts by weight (grams) depending upon the required thermal conductivity. Such formulations typically have a hardness of about 40 Shore 00 and may be provided with a skin layer to facilitate easy release from standard silicone release liners.

(B) SKIN LAYER

EXAMPLE V

[0025] 

Material	Parts by Weight, Grams
Microcrystalline wax	70
Ethylene-vinyl acetate copolymer (EVA)	90
Aliphatic c-5 petroleum hydrocarbon resin	100
Aromatic modified c-5 hydrocarbon resin	100
Alumina	555.

The microcrystalline wax selected in this example has a melting point of 55°C. and is commercially available under the trade designation "M-7332" from Moore and Munger Co. of Hartford, CT.

[0026] In certain variations of the formulation of this Example V, the alumina content may range from between 100 parts by weight (grams) to an amount up to 720 parts by weight (grams) depending upon the requisite thermal performance and physical properties.

EXAMPLE VI

[0027] 

Material	Parts by Weight, Grams
Microcrystalline wax (as in Example V)	70
Ethylene-vinyl acetate copolymer	90
Aliphatic c-5 petroleum hydrocarbon resin	100
Aromatic modified c-5 hydrocarbon resin	100
Graphite	90.

The formulation of Example V (skin) was further modified by lowering the quantity of thermally conductive particulate filler employed was graphite in the quantity indicated. Results were comparable to that of Example V (skin) but with slightly higher cohesive strength.

[0028] In variations of the formulation of this Example VI, the graphite may be present in a range of between about 90 and 150 grams, but preferably in a range of about 20% by volume. The quantity of graphite is dependent upon the thermal performance and physical properties desired.

EXAMPLE VII

[0029] 

Material	Parts by Weight, Grams
Microcrystalline wax (melting point 55°C.)	10
Silicone wax (melting point 65°C.)	25
Alumina particulate	190.

This formulation enables better mating with the silicone bulk layers and also provides hard protective layers.

EXAMPLE VIII

[0030] 

Material	Parts by Weight, Grams
Silicone elastomer with modulus of 30-70 kPa (5-10 psi)	100
Alumina powder fillers	150.

The formulation of Example VIII is utilized to prepare skin layers for use with selected bulk layers, it being noted that the elastomer selected for the bulk layer will always have a modulus significantly less than that of the skin layer. In this connection, the silicone elastomer selected for the skin layer will typically have a modulus of between about 20 - 70 kPa (5-10 psi) greater than that of its mated bulk layer.

EXAMPLE IX

[0031] 

Material	Parts by Weight, Grams
Silicone elastomer with modulus of 70-100 kPa (10-15 psi)	100
Alumina powder fillers	150.

The formulation of Example IX was similar to that of Example VIII with the exception of the silicone elastomer selected. In the formulation of Example IX, the selected silicone elastomer had a modulus of 100-140 kPa (15-20 psi). The results achieved with the skin material prepared from this formulation exhibited an increased hardness over that obtained from the formulation of Example VIII.

[0032] Each of the skin layer reactant products of Examples I through IX inclusive may be applied to a release film at a desired thickness, and thereafter placed in face-to-face contact with the bulk layer to form upper and lower skins of a pre-form. Similar or selected different skins may be utilized for a given bulk layer, with the skin selection depending, of course, upon the requirements of the ultimate application, including mechanical properties such as hardness, thermal properties, and the like. With the release films in place on the outer surfaces, the pre-form is then calendered to a desired finished thickness, with handling being facilitated by the presence of the release liners. Release liners employed with the skin layers of the present invention are preferably fabricated from standard silicone films or a polyester film such as stress-oriented polyethylene terephthalate (Teflon®).

[0033] A skin layer comprising the reactant product of Example IV was applied to the opposed major surfaces of the bulk layer of Example I, with each exposed skin layer being covered with a release liner of 25,4 µm-127 µm (1-5 mil) silicone release liner. A 76,2 µm (3-mil) silicone release liner has been found well adapted for use with skin layers of between 7,62 µm and 76,2 µm (0.3 mils and 3 mils). This composite was then passed through a pair of coordinated pinch rolls and compressed to an overall thickness of 127 µm-508 µm (5-20 mils). The resultant was a highly uniform flexible mounting pad having an overall or composite thermal conductivity of 0.5-25 W/m-K. In one application, a bulk layer having a thickness of 965 µm (38 mils) (Example I) was flanked by skin layers of 25,4 µm (1.0 mil) each (Example IV) each with release liners of 76,2 µm (3.0 mil) silicone was passed through a pair of coordinated pinch rolls and compressed to an overall thickness of 1,02 mm (40 mils). It will be appreciated that the ultimate thickness of the composite laminate is determined by the specific application contemplated for the product.

[0034] The mechanical properties of the pads were excellent, with the release liner being readily removable from the skin surface layers without any evidence of blocking.

[0035] For most applications, the bulk layer will preferably have a thickness of between about 127 µm-6,35 mm (5 and 250 mils), with a compatible skin being applied thereto. For most purposes, a skin thickness ranging from between about 2,54 µm-50,8 µm (0.1 and 2 mils) has been found useful. It will be appreciated that the actual thickness selected for the laminates having the thinner bulk material will accordingly have the thinner skins applied thereto. The converse is true for those components with greater thickness dimensions.

[0036] It will be appreciated, therefore, that the above examples are presented for illustration purposes only and are not to be construed as a limitation upon the scope of the claims to which this invention may be otherwise entitled.

Claims

1. A flexible plastic thermally conductive multi-layer semiconductor mounting pad (10) comprising a highly thermally conductive central bulk layer (11) having a hardness of 10-80 Shore 00, and thermally conductive surface skin layers (12, 13) bonded, integrally to at least one of a pair of opposed major surfaces of the central bulk layer;
said central bulk layer (11) comprising a flexible polymeric resin matrix selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester and polybutadiene; said central bulk layer (11) being filled with a finely divided thermally conductive particulate which is present in said polymeric matrix in an amount ranging from between about 10% and 85% by volume;
characterised in that said surface skin layers (12, 13) have a thickness of between 2 and 50 microns and are selected, from a polymeric resin which is compatible with the polymeric matrix of said central bulk layer (11) and selected from the group consisting of silicone, epoxy, acrylic, polyurethane, polyester and polybutadiene, and in that said surface skin layers are blended with a thermally conductive finely divided particulate filler in an amount that is less than that present in said central bulk layer, and ranging from between about 5% and 60% by volume, the hardness of said surface skin layer being substantially greater than that of the bulk layer, and ranging from between about 20 Shore 00 and 60 Shore A.

2. The semiconductor mounting pad (10) as set forth in Claim 1 wherein the polymeric resin selected for said bulk and skin layers (11, 12, 13) is a bend of silicone elastomer and thermally conductive filler.

3. The semiconductor mounting pad (10) as set forth in Claim 1 wherein the polymeric resin selected for said skin layer (12, 13) is ethylene vinyl acetate co-polymer and said bulk layer (11) is silicone elastomer.

4. The semiconductor mounting pad (10) as set forth in Claim 1 wherein said finely divided thermally conductive particulate filler is selected from the group consisting of alumina, boron nitride, aluminum nitride, graphite, silicon carbide, zinc oxide, copper powder, aluminum powder, and silver powder, other metallic powder, and blends thereof.

5. The semiconductor mounting pad (10) as set forth in Claim 1 wherein said finely divided particulate filler selected for said bulk and skin layers (11, 12, 13) is alumina.

6. The semiconductor mounting pad (10) as set forth in Claim 1 wherein said finely divided thermally conductive particulate filler is a metallic powder selected from the group consisting of aluminum, copper and silver.

7. The semiconductor mounting pad (10) as set forth in Claim 1 wherein said bulk layer (11) has a a thermal conductivity ranging from between about 1 and 15 W/m.K.

8. The semiconductor mounting pad (10) as set forth in Claim 7 wherein said skin layers (12, 13) have a thermal conductivity ranging from between about 0.3-5 W/m.K.

9. The semiconductor mounting pad (10) as set forth in Claim 2 wherein said finely divided particulate filler is alumina.

10. The semiconductor mounting pad (10) of Claim 9 wherein said filler is present in said polymeric matrix in an amount ranging from between 20% and 50% by volume and wherein said polymeric matrix has a hardness ranging from between 20-50 Shore 00.

11. The semiconductor mounting pad (10) of Claim 10 wherein said finely divided particulate filler in said skin layers (12, 13) is present in an amount ranging from between 20% and 40% by volume.

12. The semiconductor mounting pad (10) of Claim 1 wherein a thermally conductive surface skin layer is bonded integrally to each of said opposed major surfaces of said bulk layer, and wherein the polymeric matrix for each skin layer is a different polymer.

13. The semiconductor mounting pad (10) of Claim 1 wherein a thermally conductive surface skin layer (12, 13) is bonded integrally to each of said opposed major surfaces, and wherein one of said skin layers (12, 13) is blended with a significantly greater amount of finely divided particulate filler than the other skin layer (12, 13).

Ansprüche

1. Flexibles, thermisch leitfähiges, mehrschichtiges Halbleitermontagekissen aus Kunststoff (10) mit einer hochgradig thermisch leitfähigen zentralen Hauptschicht (11) mit einer Härte von 10-80 Shore 00 und mit thermisch leitfähigen Oberflächendeckschichten (12, 13), die an mindestens eine eines Paars von einander gegenüberliegenden Hauptflächen der zentralen Hauptschicht angebunden sind;
wobei die zentrale Hauptschicht (11) eine flexible Polymerharzmatrix aufweist, die aus der Gruppe ausgewählt ist, die besteht aus Silikon, Epoxid, Akryl, Polyurethan, Polyester und Polybutadien, wobei die zentrale Hauptschicht (11) mit einem fein verteilten thermisch leitfähigen Teilchenmaterial gefüllt ist, das in der Polymermatrix in einer Menge vorliegt, die von 10 bis 85 Volumen-% reicht;
dadurch gekennzeichnet, dass die Oberflächendeckschichten (12, 13) eine Dicke zwischen 2 und 50 Mikrometern haben und aus einem Polymerharz ausgewählt sind, das kompatibel mit der Polymermatrix der zentralen Hauptschicht (11) ist und aus einer Gruppe ausgewählt ist, die aus Silikon, Epoxid, Akryl, Polyurethan, Polyester und Polybutadien besteht, und dass die Oberflächendeckschichten mit einem thermisch leitfähigen, fein verteilten teilchenförmigen Füllstoff in einer Menge gemischt sind, die kleiner als diejenige ist, die in der zentralen Hauptschicht vorliegt und von ungefähr 5 bis 50 Volumen-% reicht, wobei die Härte der Oberflächendeckschicht im Wesentlichen größer als diejenige der Hauptschicht ist und von ungefähr 20 Shore 00 bis 60 Shore A reicht.

2. Halbleitermontagekissen (10) nach Anspruch 1, wobei das Polymerharz, das für die Haupt- und die Deckschichten (11, 12, 13) ausgewählt ist, eine Mischung eine Silikonelastomer und thermisch leitfähigem Füllstoff ist.

3. Halbleitermontagekissen (10) nach Anspruch 1, wobei das Polymerharz, das für die Deckschichten (12, 13) ausgewählt ist, Ethylenvinylacetatcopolymer ist, und für die Hauptschicht (11) Silikonelastomer ist.

4. Halbleitermontagekissen (10) nach Anspruch 1, wobei der fein verteilte, thermisch leitfähige teilchenförmige Füllstoff aus der Gruppe ausgewählt ist, die besteht aus Aluminiumoxid, Bornitrid, Aluminiumnitrid, Graphit, Siliziumkarbid, Zinkoxid, Kupferpulver, Aluminiumpulver und Silberpulver, anderen metallischen Pulvern und Mischungen davon.

5. Halbleitermontagekissen (10) nach Anspruch 1, wobei der fein verteilte teilchenförmige Füllstoff, der für die Haupt- und die Deckschichten (11, 12, 13) ausgewählt ist, Aluminiumoxid ist.

6. Halbleitermontagekissen (10) nach Anspruch 1, wobei der fein verteilte thermisch leitfähige teilchenförmige Füllstoff ein Metallpulver ist, das aus der Gruppe ausgewählt ist, die aus Aluminium, Kupfer und Silber besteht.

7. Halbleitermontagekissen (10) nach Anspruch 1, wobei die Hauptschicht (11) eine thermische Leitfähigkeit im Bereich zwischen ungefähr1 bis 15 W/mK aufweist.

8. Halbleitermontagekissen (10) nach Anspruch 7, wobei die Deckschichten (12, 13) eine thermische Leitfähigkeit im Bereich zwischen ungefähr 0,3 und 5 W/mK aufweisen.

9. Halbleitermontagekissen (10) nach Anspruch 2, wobei der fein verteilte teilchenförmige Füllstoff Aluminiumoxid ist.

10. Halbleitermontagekissen (10) nach Anspruch 9, wobei der Füllstoff in der Polymermatrix in einer Menge vorliegt, die von 20 bis 50 Volumen% reicht, und wobei die Polymermatrix eine Härte im Bereich von 20-50 Shore 00 aufweist.

11. Halbleitermontagekissen (10) nach Anspruch 10, wobei der fein verteilte teilchenförmige Füllstoff in den Deckschichten (12, 13) in einer Menge vorliegt, die von 20 bis 40 Volumen-% reicht.

12. Halbleitermontagekissen (10) nach Anspruch 1, wobei eine thermisch leitfähige Oberflächendeckschicht an jede der einander gegenüberliegenden Hauptflächen der Hauptschicht angebunden ist und wobei die Polymermatrix für jede Deckschicht ein unterschiedliches Polymer ist.

13. Halbleitermontagekissen (10) nach Anspruch 1, wobei eine thermisch leitfähige Oberflächendeckschicht (12, 13) an jede der einander gegenübediegenden Hauptflächen angebunden ist, und wobei eine der Deckschichten (12, 13) mit einer signifikant größeren Menge an fein verteilten teilchenförmigen Füllstoff gemischt ist als die andere Deckschicht (12, 13).

Revendications

1. Coussin de montage (10) multicouches et thermiquement conductrice, en plastique flexible, pour semi-conducteurs, comprenant une couche de coeur centrale (11) très thermiquement conductrice et ayant une dureté de 10 à 8C Shore 00, et des couches d'enveloppe de surface (12, 13) thermiquement conductrices et liées intégralement à au moins une paire de surfaces principales opposées de la couche de coeur centrale ;
ladite couche de coeur centrale (11) comprenant une matrice de résine polymère flexible choisie dans le groupe constitué par une silicone, un époxy, une substance acrylique, un polyuréthanne, un polyester et un polybutadiène ;
ladite couche de coeur centrale (11) étant remplie d'une matière particulaire thermiquement conductrice et finement divisée qui est présente dans ladite matrice polymère en une quantité allant entre environ 10 % et 85 % en volume ;
caractérisé en ce que lesdites couches d'enveloppe de surface (12, 13) ont une épaisseur d'entre 2 et 50 micromètres et sont choisies parmi une résine polymère qui est compatible avec la matrice polymère de ladite couche de coeur centrale (11) et choisie dans le groupe constitué par une silicone, un époxy, un acrylique, un polyuréthanne, un polyester et un polybutadiène, et en ce que lesdites couches d'enveloppe de surface sont mélangées avec une charge particulaire finement divisée et thermiquement conductrice en une quantité qui est inférieure à celle présente dans ladite couche de coeur centrale, et allant entre environ 5 % et 60 % en volume, la dureté de ladite couche d'enveloppe de surface étant nettement plus grande que celle de la couche de coeur, et allant entre environ 20 Shore 00 et 60 Shore A.

2. Coussin de montage (10) pour semi-conducteurs selon la revendication 1, dans lequel la résine polymère choisie pour lesdites couches de coeur et d'enveloppe (11, 12, 13) est un mélange d'élastomère silicone et de charge thermiquement conductrice.

3. Coussin de montage (10) pour semi-concucteurs selon la revendication 1, dans lequel la résine polymère choisie pour ladite couche d'enveloppe (12, 13) est un copolymère éthylène acétate de vinyle et ladite couche de coeur (11) est un élastomère silicone.

4. Coussin de montage (10) pour semi-conducteurs selon la revendication 1, dans lequel ladite charge particulaire thermiquement conductrice et finement divisée est choisie dans le groupe constitué par l'alumine, le nitrure de bore, le nitrure d'aluminium, le graphite, le carbure de silicium, l'oxyde de zinc, une poudre de cuivre, une poudre d'aluminium et une poudre d'argent, les autres poudres métalliques, et les mélanges de ceux-ci.

5. Coussin de montage (10) pour semi-conducteurs selon la revendication 1, dans lequel ladite charge particulaire finement divisée choisie pour lesdites couches de coeur et d'enveloppe (11, 12, 13) est l'alumine.

6. Coussin de montage (10) pour semi-conducteurs selon la revendication 1, dans lequel ladite charge particulaire thermiquement conductrice et finement divisée est une poudre métallique choisie dans le groupe constitué par l'aluminium, le cuivre et l'argent.

7. Coussin de montage (10) pour semi-conducteurs selon la revendication 1, dans lequel ladite couche de coeur (11) a une conductivité thermique allant entre environ 1 et 15 W/m.K.

8. Coussin de montage (10) pour semi-conducteurs selon la revendication 7, dans lequel lesdites couches d'enveloppe (12, 13) ont une conductivité thermique allant entre environ 0,3 et 5 W/m.K.

9. Coussin, de montage (10) pour semi-conducteurs selon la revendication 2, dans lequel ladite charge particulaire finement divisée est l'alumine.

10. Coussin de montage (10) pour semi-conducteurs selon la revendication 9, dans lequel ladite charge est présente dans ladite matrice polymère en une quantité allant entre 20 % et 50 % en volume et dans lequel ladite matrice polymère a une dureté allant de 20 à 50 Shore 00.

11. Coussin de montage (1C) pour semi-conducteurs selon la revendication 10, dans lequel ladite charge Particulaire finement divisée dans lesdites couches d'enveloppe (12, 13) est présente en une quantité allant entre 20 % et 40 % en volume.

12. Coussin de montage (10) pour semi-conducteurs selon la revendication 1, dans lequel une couche d'enveloppe de surface thermiquement conductrice est liée intégralement à chacune desdites surfaces principales opposées de ladite couche de coeur, et dans lequel la matrice polymère pour chaque couche d'enveloppe est un polymère différent.

13. Coussin de montage (10) pour semi-conducteurs selon la revendication 1, dans lequel une couche d'enveloppe de surface (12, 13) thermiquement conductrice est liée intégralement à chacune desdites surfaces principales opposées, et dans lequel l'une desdites couches d'enveloppe (12, 13) est mélangée avec une quantité significativement plus grande de charge particulaire finement divisée que l'autre couche d'enveloppe (12, 13).

Drawing